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DS150DF1610FB/NOPB

Texas Instruments

DS150DF1610FB/NOPB by Texas Instruments

DS150DF1610FB/NOPB by Texas Instruments is a 16-channel interface IC with a supply voltage range of 2.375V to 2.625V. It features a grid array package style, operates b/w -10°C to 85°C, and has a peak reflow temperature of 245°C. This IC is suitable for applications requiring high-speed data transmission in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,433 parts In-Stock

1+ parts

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6,433

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Digiode

USA . 2,520 parts In-Stock

1+ parts

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2,520

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,281 parts In-Stock

1+ parts

$2.273

100+ parts

-

1k+ parts

$2.774

10k+ parts

-

1,281

$2.273

-

$2.774

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ChromeModa Solutions

Germany . 2,229 parts In-Stock

1+ parts

$2.554

100+ parts

$2.094

1k+ parts

-

10k+ parts

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2,229

$2.554

$2.094

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IDEA Electronic Components Group

UK . 490 parts In-Stock

1+ parts

$2.554

100+ parts

-

1k+ parts

$2.299

10k+ parts

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490

$2.554

-

$2.299

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Native Components

USA . 690 parts In-Stock

1+ parts

$5.540

100+ parts

-

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690

$5.540

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-

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AZTECH Wire

Italy . 676 parts In-Stock

1+ parts

$9.010

100+ parts

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676

$9.010

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One Stop Electronics

USA . 424 parts In-Stock

1+ parts

$31.500

100+ parts

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424

$31.500

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Corphita

USA . 3,436 parts In-Stock

1+ parts

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3,436

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Microchip USA

USA . 1,402 parts In-Stock

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1,402

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Northwest PG Solutions

USA . 1,171 parts In-Stock

1+ parts

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100+ parts

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$5.429

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1,171

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$5.429

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DigiPath Technology Company

USA . 779 parts In-Stock

1+ parts

-

100+ parts

$2.303

1k+ parts

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779

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$2.303

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Overview

Experience unparalleled performance and reliability with the DS150DF1610FB/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality in their products. This interface IC is perfect for a wide range of applications, offering customers seamless connectivity and high-speed data transmission. With its advanced technology and innovative design, the DS150DF1610FB/NOPB provides exceptional value and efficiency to meet all your needs. Trust Texas Instruments for superior solutions that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers durability and resistance to environmental factors, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and improving assembly processes.

Maximum Supply Voltage: 2.625 V

The high maximum supply voltage allows for compatibility with a wide range of power sources, enhancing versatility.

Package Shape: SQUARE

Square package shape simplifies integration into circuit designs and provides a uniform appearance for aesthetics.

No. of Terminals: 196

The large number of terminals enables complex connectivity options and enhances the functionality of the product.

Package Style (Meter): GRID ARRAY

Grid array package style offers a compact and organized layout for terminals, facilitating easier circuit board design.

Minimum Operating Temperature: -10 °C

The wide temperature range allows for reliable operation in various environmental conditions, increasing the product's versatility.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage provides stable and consistent power delivery, ensuring reliable performance of the product.

Interface IC Type: INTERFACE CIRCUIT

The specific type of interface IC caters to the requirements of the intended application, enhancing compatibility and functionality.

Technical Specifications

Other Function Interface ICs DS150DF1610FB/NOPB attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

15.05 mm

Moisture Sensitivity Level (MSL):

4

No. of Channels:

16

No. of Functions:

1

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.94 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15.05 mm

Trade Compliance

DS150DF1610FB/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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