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DS150DF1610FBE/NOPB

Texas Instruments

DS150DF1610FBE/NOPB by Texas Instruments

DS150DF1610FBE/NOPB by Texas Instruments is a 16-channel interface IC with a supply voltage range of 2.375V to 2.625V. It features a grid array package style, operates b/w -10°C to 85°C, and has a terminal pitch of 1mm. Ideal for applications requiring high-speed data transmission in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,647 parts In-Stock

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4,647

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Digiode

USA . 3,043 parts In-Stock

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3,043

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Distributors (Availability)

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Native Components

USA . 688 parts In-Stock

1+ parts

$0.155

100+ parts

-

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$0.149

688

$0.155

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$0.149

Northwest PG Solutions

USA . 1,051 parts In-Stock

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$0.171

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$0.150

1,051

$0.171

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$0.150

AZTECH Wire

Italy . 739 parts In-Stock

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$6.317

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739

$6.317

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Parana Technologies

USA . 1,267 parts In-Stock

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$10.762

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$11.244

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1,267

$10.762

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$11.244

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DigiPath Technology Company

USA . 1,825 parts In-Stock

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$11.850

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1,825

$11.850

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ChromeModa Solutions

Germany . 4,022 parts In-Stock

1+ parts

$12.092

100+ parts

$9.915

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4,022

$12.092

$9.915

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IDEA Electronic Components Group

UK . 1,044 parts In-Stock

1+ parts

$12.092

100+ parts

$11.487

1k+ parts

$10.883

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1,044

$12.092

$11.487

$10.883

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One Stop Electronics

USA . 406 parts In-Stock

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$20.500

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406

$20.500

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Microchip USA

USA . 2,141 parts In-Stock

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Corphita

USA . 1,001 parts In-Stock

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Overview

Unlock seamless communication and superior performance with the DS150DF1610FBE/NOPB by Texas Instruments. Crafted with precision and expertise, this interface IC offers unparalleled reliability and efficiency in a wide range of applications. Whether you're in the telecommunications industry or working on high-speed networking projects, this product delivers exceptional value and benefits to meet your needs. Trust Texas Instruments for cutting-edge solutions that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards.

Maximum Supply Voltage: 2.625 V

Operates at a maximum voltage of 2.625V, suitable for low power applications.

Package Shape: SQUARE

Square shape package allows for efficient use of space on the circuit board.

No. of Terminals: 196

High number of terminals provide multiple interface options for various functions.

Package Style (Meter): GRID ARRAY

Grid array package style offers secure and precise connections for improved performance.

Maximum Operating Temperature: 85 °C

Can tolerate high operating temperatures, suitable for industrial and automotive applications.

Minimum Operating Temperature: -10 °C

Wide temperature range allows for operation in various environmental conditions.

Terminal Finish: TIN SILVER COPPER

Multiple terminal finish options provide improved conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and mounting onto the PCB.

Maximum Seated Height: 2.94 mm

Low profile design minimizes space requirements and allows for compact system designs.

Width: 15.05 mm

Optimal width dimension for easy integration into circuit layout and design.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and efficient soldering during manufacturing process.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures secure and reliable solder joints.

Length: 15.05 mm

Proper length dimension for compact and space-efficient circuit board designs.

No. of Channels: 16

Multiple channels enable versatile interface options for different functions.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections for improved performance.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent and reliable performance.

Terminal Pitch: 1 mm

Optimal terminal pitch for easy soldering and mounting onto the circuit board.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates good moisture resistance for reliable operation in humid environments.

Interface IC Type: INTERFACE CIRCUIT

Specialized interface IC type ensures seamless communication and compatibility with other components.

Technical Specifications

Other Function Interface ICs DS150DF1610FBE/NOPB attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

15.05 mm

Moisture Sensitivity Level (MSL):

4

No. of Channels:

16

No. of Functions:

1

No. of Terminals:

196

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.94 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15.05 mm

Trade Compliance

DS150DF1610FBE/NOPB Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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