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IP4853CX24/P,135

NXP Semiconductors

IP4853CX24/P,135 by NXP Semiconductors

IP4853CX24/P,135 from NXP Semiconductors is a compact interface IC designed for surface mount applications. It operates at a nominal voltage of 1.8V and features a fine pitch grid array with 24 terminals. This device functions effectively in environments ranging from -30 °C to 85 °C.

Median Price

$0.515

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 19 parts In-Stock

1+ parts

-

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$0.515

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$0.428

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$0.381

19

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$0.515

$0.428

$0.381

Distributors (In-Stock)

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Digiode

USA . 3,619 parts In-Stock

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$0.206

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3,619

$0.206

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Vyrian

USA . 2,471 parts In-Stock

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2,471

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Anansix

USA . 193 parts In-Stock

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193

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Distributors (Availability)

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Corphita

USA . 3,182 parts In-Stock

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$0.195

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3,182

$0.195

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Component Stockers USA

USA . 11 parts In-Stock

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$0.220

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11

$0.220

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Microchip USA

USA . 190 parts In-Stock

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$6.105

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190

$6.105

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AZTECH Wire

Italy . 898 parts In-Stock

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$13.480

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898

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UNI Independent Distributors

Spain . 3,869 parts In-Stock

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Overview

Unlock the potential of your designs with NXP Semiconductors' IP4853CX24/P,135, a versatile interface IC that promises unparalleled quality and reliability. Engineered for excellence, this compact component enhances performance across diverse applications, from industrial automation to consumer electronics. With NXP's renowned innovation backing it, you gain efficiency, durability, and seamless integration, ensuring your projects stand out in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and a lightweight design, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern circuit boards, promoting space efficiency.

Package Shape: SQUARE

A square package shape assists in efficient space utilization on PCB layouts, enabling better performance in confined spaces.

Power Supplies (V): 1.8

Operating at a low voltage of 1.8 V enhances energy efficiency and is compatible with many low-power applications.

No. of Terminals: 24

With 24 terminals, this product provides ample connectivity options, allowing for complex signal processing and interface capabilities.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array design offers high-density interconnection capabilities, making it ideal for high-performance systems.

Maximum Operating Temperature: 85 °C

An upper temperature limit of 85 °C ensures reliable operation in various environments, suitable for industrial and commercial applications.

Minimum Operating Temperature: -30 °C

A minimum operating temperature of -30 °C enables reliable performance in colder climates, expanding its application range.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates better thermal performance and allows for optimized placement on PCBs.

Terminal Form: BALL

Ball-shaped terminals enhance soldering reliability and are ideal for automated assembly processes.

Nominal Supply Voltage: 1.8 V

The nominal voltage of 1.8 V aligns with industry standards for low-power electronics, providing versatility in usage.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch allows for compact spacing between connections, accommodating high-density designs without compromising performance.

Technical Specifications

Other Function Interface ICs IP4853CX24/P,135 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Trade Compliance

IP4853CX24/P,135 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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