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IP4853CX24/LF/P,13

NXP Semiconductors

IP4853CX24/LF/P,13 by NXP Semiconductors

IP4853CX24/LF/P,13 from NXP Semiconductors is a compact interface IC designed for surface mount applications. It operates at a nominal voltage of 1.8V and features a fine pitch grid array with 24 terminals. With an operating temp range of -30 °C to 85 °C, it's ideal for various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,187 parts In-Stock

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4,187

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Vyrian

USA . 2,033 parts In-Stock

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2,033

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Anansix

USA . 1,891 parts In-Stock

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1,891

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One Stop Electronics

USA . 1,051 parts In-Stock

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$32.500

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1,051

$32.500

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UNI Independent Distributors

Spain . 5,413 parts In-Stock

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5,413

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Corphita

USA . 263 parts In-Stock

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263

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Overview

Elevate your designs with the IP4853CX24/LF/P,13 from NXP Semiconductors, a trusted leader in innovative solutions. This high-quality interface IC ensures seamless communication in various applications, from consumer electronics to industrial automation. With its robust performance across a wide temperature range and space-saving design, you can achieve efficiency without compromising on reliability. Experience unmatched value and performance that empowers your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers a lightweight and durable package that provides good protection against environmental stresses, making the IC reliable in various applications.

Surface Mount: YES

Being surface mount enables the IC to be easily integrated into modern PCB designs, saving space and allowing for higher circuit density.

Package Shape: SQUARE

A square package shape optimizes space on the PCB and allows for effective heat dissipation, contributing to performance stability.

Power Supplies (V): 1.8

A low power supply requirement of 1.8V is energy-efficient, making this IC a suitable choice for battery-powered devices and lower power applications.

No. of Terminals: 24

With 24 terminals, this IC provides adequate I/O connections for various functionalities, enabling flexibility in design and application.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array package style allows for a high density of connections which is essential for advanced applications requiring compact design.

Maximum Operating Temperature: 85 °C

An operating temperature range up to 85 °C ensures that this IC can function in environments with moderate heat, extending its usability.

Minimum Operating Temperature: -30 °C

The capability to operate down to -30 °C makes the IC suitable for applications in colder environments, enhancing its versatility.

Terminal Position: BOTTOM

Bottom terminal positioning optimizes the connection to the PCB, improving signal integrity and simplifying the assembly process.

Terminal Form: BALL

Ball terminal form promotes better solderability and mechanical strength during soldering processes, ensuring reliable connections.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8 V confirms energy efficiency and compatibility with integrated power management systems.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm allows for a compact layout, making this IC an excellent choice for space-constrained applications.

Technical Specifications

Other Function Interface ICs IP4853CX24/LF/P,13 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Trade Compliance

IP4853CX24/LF/P,13 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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