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IP4853CX24,135

NXP Semiconductors

IP4853CX24,135 by NXP Semiconductors

IP4853CX24,135 by NXP Semiconductors is a compact interface IC designed for surface mount applications. It operates at a nominal voltage of 1.8V and features a fine pitch grid array with 24 terminals. This device functions effectively in environments ranging from -30 °C to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,812 parts In-Stock

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4,812

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Vyrian

USA . 1,912 parts In-Stock

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1,912

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Anansix

USA . 1,251 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 322 parts In-Stock

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$29.500

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322

$29.500

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UNI Independent Distributors

Spain . 7,914 parts In-Stock

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7,914

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Corphita

USA . 4,654 parts In-Stock

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Overview

Elevate your designs with the IP4853CX24,135 from NXP Semiconductors, a trusted leader in innovation. This versatile interface IC excels in delivering reliability and performance across various applications, from industrial automation to consumer electronics. Its compact square package ensures seamless integration, while its robust temperature range guarantees optimal functionality in diverse environments. Experience superior quality and unmatched support, empowering your projects to thrive!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

The surface mount capability enables compact designs and easier integration into modern electronic circuits, enhancing overall efficiency.

Package Shape: SQUARE

A square package shape allows for optimal space utilization on circuit boards, facilitating high-density layouts.

Power Supplies (V): 1.8

Designed to operate at a low voltage of 1.8V, this product improves power efficiency and reduces energy consumption in electronic devices.

No. of Terminals: 24

With 24 terminals, this device offers a good balance of functionality and size, making it suitable for complex circuitry without excessive footprint.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch design enhances interconnectivity and reduces the distance between terminals, enabling faster data transfer rates.

Maximum Operating Temperature: 85 °C

Operating reliably up to 85 °C makes this product ideal for high-temperature applications, ensuring stability in demanding environments.

Minimum Operating Temperature: -30 °C

A minimum operating temperature of -30 °C ensures the product performs effectively in colder climates, increasing its versatility.

Terminal Position: BOTTOM

Bottom terminal positioning optimizes space on the surface of the PCB, facilitating better layout and minimizing interference with other components.

Terminal Form: BALL

Ball terminal form allows for reliable electrical connections and easy handling during assembly, enhancing the robustness of the overall design.

Nominal Supply Voltage: 1.8 V

Operating at a nominal voltage of 1.8V ensures compatibility with low-voltage systems, making it an excellent choice for power-sensitive applications.

Terminal Pitch: 0.4 mm

The 0.4 mm terminal pitch provides a compact footprint while maintaining a high density of connections, essential for modern compact electronic devices.

Technical Specifications

Other Function Interface ICs IP4853CX24,135 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Trade Compliance

IP4853CX24,135 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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