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ISO7241ADWR

Texas Instruments

ISO7241ADWR by Texas Instruments

ISO7241ADWR by Texas Instruments is a 16-terminal digital isolator with 4 functions. It operates b/w -40 to 125 °C and has a supply voltage range of 3.15-3.6 V, making it ideal for automotive applications requiring high temperature tolerance and electrical isolation.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 4,768 parts In-Stock

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4,768

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Digiode

USA . 4,075 parts In-Stock

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Chip Stock

USA . 2,680 parts In-Stock

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2,680

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ComSIT Distribution GmbH

Germany . 839 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 154 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Aztec Data Supply Inc.

USA . 4,160 parts In-Stock

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$7.450

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$7.450

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One Stop Electronics

USA . 1,077 parts In-Stock

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$8.500

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1,077

$8.500

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Parana Technologies

USA . 193 parts In-Stock

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$9.206

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$854.932

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$8.286

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193

$9.206

$854.932

$8.286

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AZTECH Wire

Italy . 896 parts In-Stock

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$9.669

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DigiPath Technology Company

USA . 783 parts In-Stock

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$10.137

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783

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ChromeModa Solutions

Germany . 1,807 parts In-Stock

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$10.344

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$8.482

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IDEA Electronic Components Group

UK . 1,244 parts In-Stock

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$10.344

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$9.827

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$9.310

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Semicontronic

India . 758 parts In-Stock

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$10.500

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$10.238

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$10.185

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758

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Ampacity Inc.

Singapore . 429 parts In-Stock

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$49.500

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Lixinc

USA . 15,888 parts In-Stock

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A-Z Elektronik GmbH

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Kepictronics

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Infinite Electronics LLP (Excess)

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Formix International (Excess)

India . 4,408 parts In-Stock

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Continental Prestige Electronics

USA . 2,359 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Argo Parts USA

USA . 608 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Elevate your electronic designs with the Texas Instruments ISO7241ADWR, a top-of-the-line digital isolator that guarantees quality and reliability. With its innovative technology and superior performance, this product is perfect for a wide range of applications. Experience seamless connectivity and enhanced efficiency with the ISO7241ADWR, designed to meet the demands of today's fast-paced world. Trust in Texas Instruments and take your projects to the next level with this exceptional interface IC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the product, making it suitable for various applications.

Surface Mount: YES

Being surface mountable makes it easier to integrate this IC into compact and space-constrained electronic devices.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this IC can handle power inputs efficiently without the risk of damage.

No. of Functions: 4

Having 4 functions in a single IC offers increased functionality and versatility for different applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy placement and alignment during PCB assembly, improving overall efficiency.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options for interfacing with other components in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic designs.

Minimum Supply Voltage: 3.15 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing flexibility.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the IC to perform reliably even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures makes this IC suitable for use in both hot and cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout, allowing for multiple orientation options during installation.

Maximum Seated Height: 2.65 mm

The low seated height of the IC helps in maintaining a slim profile for the final electronic device.

Width: 7.5 mm

Narrow width of the IC enables easy integration into tight spaces without compromising on performance.

Maximum Time At Peak Reflow Temperature (s): 30

The controlled reflow process with a maximum time limit ensures reliable soldering and prevents damage to the IC.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the IC can withstand the soldering process without issues.

Length: 10.3 mm

The compact length of the IC contributes to space-saving design while maintaining functionality.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures the IC can withstand the rigors of automotive applications.

No. of Channels: 4

Having 4 channels allows for multiple data or signal paths, increasing the versatility of the IC in various applications.

Terminal Form: GULL WING

Gull wing terminal form offers secure and stable connectivity during PCB assembly and operation.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage provides a stable power input for consistent performance of the IC.

Terminal Pitch: 1.27 mm

The tight terminal pitch allows for high-density mounting, optimizing PCB space and connectivity options.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates the IC's resistance to moisture and enhances its reliability in humid or wet conditions.

Interface IC Type: DIGITAL ISOLATOR

Being a digital isolator, this IC provides reliable signal isolation between different circuits, ensuring data integrity and safety.

Technical Specifications

Other Function Interface ICs ISO7241ADWR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 4.5V TO 5.5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7241ADWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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