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TXB0108RGYRG4

Texas Instruments

TXB0108RGYRG4 by Texas Instruments

TXB0108RGYRG4 by Texas Instruments is an interface IC with 20 terminals, operating at -40 to 85 °C. It has a supply voltage range of 1.2-5.5 V and terminal finish of NiPdAu. Widely used in industrial applications requiring reliable signal conversion and processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 32,120 parts In-Stock

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Vyrian

USA . 4,159 parts In-Stock

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4,159

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Digiode

USA . 3,147 parts In-Stock

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3,147

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Distributors (Availability)

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Semicontronic

India . 540 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

-

540

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 403 parts In-Stock

1+ parts

$5.010

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-

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403

$5.010

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Parana Technologies

USA . 1,138 parts In-Stock

1+ parts

$7.231

100+ parts

-

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$7.734

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1,138

$7.231

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$7.734

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$7.650

100+ parts

$7.267

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$7.267

10k+ parts

-

1,000

$7.650

$7.267

$7.267

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ChromeModa Solutions

Germany . 5,379 parts In-Stock

1+ parts

$8.125

100+ parts

$6.662

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$8.125

$6.662

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IDEA Electronic Components Group

UK . 830 parts In-Stock

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$8.125

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$7.312

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830

$8.125

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$7.312

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Corohmni

South Africa . 332 parts In-Stock

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$10.336

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332

$10.336

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One Stop Electronics

USA . 1,475 parts In-Stock

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$16.500

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$16.500

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Ampacity Inc.

Singapore . 1,477 parts In-Stock

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$19.500

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$19.500

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A-Z Elektronik GmbH

Germany . 7,418 parts In-Stock

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Continental Prestige Electronics

USA . 6,524 parts In-Stock

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Corphita

USA . 3,590 parts In-Stock

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DigiPath Technology Company

USA . 2,094 parts In-Stock

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$7.326

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$7.326

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iodParts Technologies Inc.

India . 1,938 parts In-Stock

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Argo Parts USA

USA . 1,427 parts In-Stock

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Modulus Dynamics

Lithuania . 550 parts In-Stock

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550

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Robosynatics

Brazil . 200 parts In-Stock

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200

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Lucentia Tech

USA . 200 parts In-Stock

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$0.209

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$0.209

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$0.209

200

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$0.209

$0.209

$0.209

Overview

Experience seamless integration and superior performance with the TXB0108RGYRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unmatched quality and reliability. This interface IC is perfect for a wide range of applications, offering customers a versatile solution for their needs. With its advanced features and innovative design, the TXB0108RGYRG4 provides exceptional value and benefits, making it the ideal choice for your projects. Upgrade your systems today and discover the advantages of Texas Instruments technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and replacement of the IC, making it convenient for production and maintenance processes.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this IC can handle higher power requirements and voltages, increasing its versatility in different circuits.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to integrate into circuit designs and ensures efficient use of space on a circuit board.

Power Supplies (V): 1.2/3.6, 1.8/5

The multiple power supply options provide flexibility in voltage requirements, allowing the IC to be used in various power settings.

No. of Terminals: 20

The 20 terminals offer a wide range of connectivity options, enabling the IC to interface with multiple devices or components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles provide different options for heat dissipation, space constraints, and overall form factor, making it adaptable to different needs.

Minimum Supply Voltage: 1.2 V

With a low minimum supply voltage, this IC can operate efficiently even in low-power situations, making it energy-efficient.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this IC suitable for use in industrial environments or applications where heat dissipation is a concern.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates that the IC has a moderate level of moisture sensitivity, ensuring reliability and performance in various environmental conditions.

Technical Specifications

Other Function Interface ICs TXB0108RGYRG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20/24,.14X.18,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.6,1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.65 V

Nominal Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Trade Compliance

TXB0108RGYRG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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