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ISO7740DBQR

Texas Instruments

ISO7740DBQR by Texas Instruments

ISO7740DBQR by Texas Instruments is a 16-terminal IC with 4 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 2.25-5.5 V and is suitable for military-grade applications requiring interface circuitry in compact spaces.

Median Price

$1.602

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,706 parts In-Stock

1+ parts

$1.608

100+ parts

$1.328

1k+ parts

$0.718

10k+ parts

-

9,706

$1.608

$1.328

$0.718

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Arrow

USA . 1,492 parts In-Stock

1+ parts

$2.591

100+ parts

$1.595

1k+ parts

$1.452

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-

1,492

$2.591

$1.595

$1.452

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Mouser Electronics

USA . 2,550 parts In-Stock

1+ parts

$2.960

100+ parts

$1.810

1k+ parts

$1.800

10k+ parts

$1.520

2,550

$2.960

$1.810

$1.800

$1.520

Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

-

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$1.360

2,500

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$1.360

DigiKey

USA . 2,299 parts In-Stock

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-

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$1.583

2,299

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$1.583

Verical

USA . 1,492 parts In-Stock

1+ parts

-

100+ parts

$1.595

1k+ parts

$1.452

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1,492

-

$1.595

$1.452

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,504 parts In-Stock

1+ parts

$1.528

100+ parts

-

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3,504

$1.528

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Nova Conductors

Japan . 57 parts In-Stock

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$1.695

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57

$1.695

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Maritex

Poland . 70 parts In-Stock

1+ parts

$1.773

100+ parts

$1.106

1k+ parts

$0.898

10k+ parts

-

70

$1.773

$1.106

$0.898

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Chip Stock

USA . 35,487 parts In-Stock

1+ parts

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35,487

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Vyrian

USA . 6,361 parts In-Stock

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6,361

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Distributors (Availability)

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Semicontronic

India . 6,692 parts In-Stock

1+ parts

$1.070

100+ parts

$1.043

1k+ parts

$1.038

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6,692

$1.070

$1.043

$1.038

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Ampacity Inc.

Singapore . 6,589 parts In-Stock

1+ parts

$1.070

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6,589

$1.070

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Corphita

USA . 4,413 parts In-Stock

1+ parts

$1.447

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4,413

$1.447

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Continental Prestige Electronics

USA . 5,914 parts In-Stock

1+ parts

$1.695

100+ parts

-

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10k+ parts

$1.661

5,914

$1.695

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-

$1.661

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.695

100+ parts

-

1k+ parts

$1.610

10k+ parts

$1.576

1,000

$1.695

-

$1.610

$1.576

Argo Parts USA

USA . 191 parts In-Stock

1+ parts

$1.695

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191

$1.695

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$6.237

100+ parts

$5.925

1k+ parts

$5.925

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200

$6.237

$5.925

$5.925

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Parana Technologies

USA . 300 parts In-Stock

1+ parts

$7.448

100+ parts

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$7.936

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300

$7.448

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$7.936

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DigiPath Technology Company

USA . 365 parts In-Stock

1+ parts

$8.201

100+ parts

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365

$8.201

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ChromeModa Solutions

Germany . 1,914 parts In-Stock

1+ parts

$8.368

100+ parts

$6.862

1k+ parts

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1,914

$8.368

$6.862

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IDEA Electronic Components Group

UK . 156 parts In-Stock

1+ parts

$8.368

100+ parts

$7.950

1k+ parts

$7.531

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156

$8.368

$7.950

$7.531

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Corohmni

South Africa . 1,040 parts In-Stock

1+ parts

$8.452

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1,040

$8.452

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A-Z Elektronik GmbH

Germany . 3,750 parts In-Stock

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3,750

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Lixinc

USA . 3,607 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Overview

Elevate your projects with the Texas Instruments ISO7740DBQR, a top-tier interface IC designed for exceptional performance and reliability. With a small outline package and dual terminal position, this versatile IC offers seamless integration and ease of use. Whether you're working on industrial automation, automotive systems, or IoT applications, the ISO7740DBQR delivers the quality and precision you need to take your designs to the next level. Trust in Texas Instruments for cutting-edge technology and unmatched expertise in interface circuitry. Experience the difference with the ISO7740DBQR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the integrated circuits inside.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on a circuit board.

Maximum Supply Voltage: 5.5 V

Can handle a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 4

Four functions in one IC provide cost and space savings compared to using multiple individual components.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easy to handle in manufacturing processes.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functionalities to be integrated into the device.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch design save space on the circuit board, ideal for compact electronic devices.

Minimum Supply Voltage: 2.25 V

Works efficiently even at low supply voltages, improving energy efficiency and performance.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures without compromising performance, suitable for various environments.

Minimum Operating Temperature: -55 °C

Can withstand cold temperatures, ensuring reliability in extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel, Palladium, and Gold finish provides excellent conductivity and corrosion resistance for the terminals.

Terminal Position: DUAL

Dual terminal position allows for better stability and connectivity in the circuit.

Maximum Seated Height: 1.75 mm

Low seated height helps in slimming down the overall profile of the device.

Width: 3.895 mm

Compact width size enables easy integration into tight spaces on the circuit board.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly processes without damage.

Length: 4.905 mm

Optimal length dimension for fitting into various electronic devices and applications.

Temperature Grade: MILITARY

MILITARY-grade temperature handling ensures reliability and performance in harsh conditions.

No. of Channels: 4

Four channels provide flexibility in functionality and signal processing capabilities.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and mechanical stability on the circuit board.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and reliability.

Terminal Pitch: 0.635 mm

Narrow terminal pitch allows for compact design and space-saving on the circuit board.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates moderate sensitivity to moisture, suitable for standard handling and storage.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuit applications, providing efficient signal processing and communication capabilities.

Technical Specifications

Other Function Interface ICs ISO7740DBQR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.895 mm

Trade Compliance

ISO7740DBQR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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