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IP4853CX24/LF/T3

NXP Semiconductors

IP4853CX24/LF/T3 by NXP Semiconductors

IP4853CX24/LF/T3 from NXP Semiconductors is a compact, surface-mount interface IC designed for reliable performance in various applications. It operates at a nominal voltage of 1.8V and supports temperatures from -30 °C to 85 °C. With 24 terminals in a fine pitch grid array, it’s ideal for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,918 parts In-Stock

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1,918

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Vyrian

USA . 1,277 parts In-Stock

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1,277

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Anansix

USA . 1,093 parts In-Stock

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1,093

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Distributors (Availability)

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One Stop Electronics

USA . 698 parts In-Stock

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$36.500

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698

$36.500

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UNI Independent Distributors

Spain . 5,438 parts In-Stock

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5,438

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Corphita

USA . 1,334 parts In-Stock

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Overview

Unlock new possibilities with the IP4853CX24/LF/T3 from NXP Semiconductors, a leader in innovation and quality. This versatile interface IC is designed to streamline your applications, delivering reliability and performance across diverse environments. Its compact, surface-mount design ensures efficient use of space while operating flawlessly in extreme temperatures. Experience enhanced connectivity and efficiency that empower your projects—choose NXP for unparalleled excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY as the package body material ensures durability and protection from environmental factors, making this IC suitable for various applications.

Surface Mount: YES

Being a surface mount IC allows for compact and efficient PCB designs, saving valuable space while enhancing performance.

Package Shape: SQUARE

The square package shape provides an even distribution of thermal and electrical performance, contributing to reliability and efficiency.

Power Supplies (V): 1.8

Operating at 1.8V makes this IC compatible with low-power applications, supporting energy efficiency and longer battery life in devices.

No. of Terminals: 24

With 24 terminals, this IC allows for extensive connections, enabling integration with multiple functions and features in complex designs.

Package Style (Meter): GRID ARRAY, FINE PITCH

The GRID ARRAY, FINE PITCH design facilitates higher density and smaller form factors, making it ideal for advanced electronics in limited space.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in robust environments, making it suitable for industrial applications.

Minimum Operating Temperature: -30 °C

With a minimum operating temperature of -30 °C, this IC can function in harsh conditions, broadening its application range.

Terminal Position: BOTTOM

Bottom terminal positioning enhances the ability to route connections efficiently on PCB layouts, promoting better signal integrity.

Terminal Form: BALL

Ball terminal form provides excellent solder joint reliability and improved thermal performance, ensuring long-term performance.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8V further confirms its suitability for energy-sensitive applications, aligning perfectly with modern energy regulations.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm allows for high-density configuration, accommodating more connections in a smaller area, beneficial for compact electronic designs.

Technical Specifications

Other Function Interface ICs IP4853CX24/LF/T3 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B24

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Trade Compliance

IP4853CX24/LF/T3 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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