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ADG3304BCBZ-REEL

Analog Devices

ADG3304BCBZ-REEL by Analog Devices

ADG3304BCBZ-REEL by Analog Devices is a CMOS interface IC with 12 terminals, operating b/w -25 to 85 °C. It has a supply voltage range of 1.15V to 5.5V and features a grid array package style for surface mount applications. Ideal for various electronic devices requiring precise signal interfacing at low power consumption levels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 29,815 parts In-Stock

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29,815

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Vyrian

USA . 10,594 parts In-Stock

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10,594

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Digiode

USA . 264 parts In-Stock

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264

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Native Components

USA . 249 parts In-Stock

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$0.293

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$0.281

249

$0.293

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$0.281

Northwest PG Solutions

USA . 1,946 parts In-Stock

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$0.322

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$0.284

1,946

$0.322

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$0.284

Parana Technologies

USA . 2,243 parts In-Stock

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$3.949

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$3.672

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2,243

$3.949

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$3.672

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IDEA Electronic Components Group

UK . 304 parts In-Stock

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$4.246

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$4.034

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304

$4.246

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$4.034

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DigiPath Technology Company

USA . 635 parts In-Stock

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$6.624

100+ parts

$6.359

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635

$6.624

$6.359

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AZTECH Wire

Italy . 631 parts In-Stock

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$12.935

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631

$12.935

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One Stop Electronics

USA . 1,145 parts In-Stock

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$26.500

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$26.500

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Semicontronic

India . 792 parts In-Stock

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$48.500

100+ parts

$47.288

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$47.045

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792

$48.500

$47.288

$47.045

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RC Electronics

USA . 17,000 parts In-Stock

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GreenTree Electronics

Israel . 15,000 parts In-Stock

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Vigor

Singapore . 2,616 parts In-Stock

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2,616

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Microchip USA

USA . 486 parts In-Stock

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486

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Corphita

USA . 454 parts In-Stock

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454

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Overview

Experience superior quality and reliability with the ADG3304BCBZ-REEL by Analog Devices, a leading manufacturer known for innovative solutions in the category of Other Function Interface ICs. This product offers exceptional value with its advanced technology, ensuring seamless performance in various applications. With a wide operating temperature range and compact design, customers can benefit from enhanced efficiency and flexibility in their projects. Trust Analog Devices to deliver cutting-edge solutions that elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy packaging material provides durability and protection to the IC, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Support for a high maximum supply voltage ensures compatibility with a wide range of power sources.

Package Shape: RECTANGULAR

The rectangular shape provides a standard form factor for easy PCB mounting and design.

Power Supplies (V): 1.8/5

Support for multiple power supply voltages allows for versatile use in different electric circuits.

No. of Terminals: 12

Having 12 terminals enables connectivity to multiple input/output devices, increasing the functionality of the IC.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enables high-density mounting and improved signal integrity.

Minimum Operating Temperature: -25 °C

With a low minimum operating temperature, this IC can operate effectively in a wide range of environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable in various applications.

Technical Specifications

Other Function Interface ICs ADG3304BCBZ-REEL attributes and parameters. Explore more Other Function Interface ICs devices from Analog Devices

Specs

Interface IC Type:

JESD-30 Code:

R-PBGA-B12

JESD-609 Code:

e1

Length:

2.01 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA12,3X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.65 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

1.61 mm

Trade Compliance

ADG3304BCBZ-REEL Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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