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DS250DF210ABMR

Texas Instruments

DS250DF210ABMR by Texas Instruments

DS250DF210ABMR by Texas Instruments is a 2-channel interface IC with a temperature range of -40 to 85°C. It features a grid array package style, 0.5mm terminal pitch, and TSC terminal finish. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

Median Price

$21.912

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,865 parts In-Stock

1+ parts

$21.912

100+ parts

$19.140

1k+ parts

$13.200

10k+ parts

-

7,865

$21.912

$19.140

$13.200

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,225 parts In-Stock

1+ parts

$20.816

100+ parts

-

1k+ parts

-

10k+ parts

-

2,225

$20.816

-

-

-

Vyrian

USA . 3,274 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,274

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 596 parts In-Stock

1+ parts

$0.276

100+ parts

-

1k+ parts

-

10k+ parts

$0.265

596

$0.276

-

-

$0.265

Northwest PG Solutions

USA . 102 parts In-Stock

1+ parts

$0.303

100+ parts

-

1k+ parts

-

10k+ parts

$0.267

102

$0.303

-

-

$0.267

Parana Technologies

USA . 661 parts In-Stock

1+ parts

$11.763

100+ parts

-

1k+ parts

$12.164

10k+ parts

-

661

$11.763

-

$12.164

-

AZTECH Wire

Italy . 1,107 parts In-Stock

1+ parts

$12.950

100+ parts

-

1k+ parts

-

10k+ parts

-

1,107

$12.950

-

-

-

ChromeModa Solutions

Germany . 2,650 parts In-Stock

1+ parts

$13.217

100+ parts

$10.838

1k+ parts

-

10k+ parts

-

2,650

$13.217

$10.838

-

-

IDEA Electronic Components Group

UK . 1,834 parts In-Stock

1+ parts

$13.217

100+ parts

$12.556

1k+ parts

$11.895

10k+ parts

-

1,834

$13.217

$12.556

$11.895

-

Corphita

USA . 3,114 parts In-Stock

1+ parts

$19.721

100+ parts

-

1k+ parts

-

10k+ parts

-

3,114

$19.721

-

-

-

Microchip USA

USA . 1,139 parts In-Stock

1+ parts

$48.530

100+ parts

$47.840

1k+ parts

$47.490

10k+ parts

$47.140

1,139

$48.530

$47.840

$47.490

$47.140

DigiPath Technology Company

USA . 2,261 parts In-Stock

1+ parts

-

100+ parts

$11.916

1k+ parts

-

10k+ parts

-

2,261

-

$11.916

-

-

Overview

Elevate your electronic designs with the DS250DF210ABMR by Texas Instruments. Crafted with precision and expertise, this interface IC offers unrivaled quality and reliability. Perfect for a wide range of applications in the industrial sector, this product delivers seamless connectivity and optimal performance. Experience the value of advanced technology and the benefits of superior engineering with Texas Instruments. Trust in their legacy of excellence and elevate your projects to new heights with the DS250DF210ABMR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various industrial applications.

Surface Mount: YES

Allows for easy and reliable PCB mounting, saving time during assembly.

No. of Terminals: 101

Provides a high level of connectivity for multiple functions within the interface IC.

Terminal Finish: TIN SILVER COPPER

Ensures good conductivity and corrosion resistance for reliable performance over time.

Width: 6 mm

Compact size allows for efficient use of PCB space in cramped electronics designs.

Technical Specifications

Other Function Interface ICs DS250DF210ABMR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B101

JESD-609 Code:

e1

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

101

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.03 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

DS250DF210ABMR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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