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DS250DF410ABMT

Texas Instruments

DS250DF410ABMT by Texas Instruments

DS250DF410ABMT by Texas Instruments is a 4-channel interface IC with a package style of grid array, thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) with peak reflow temperature of 260°C. Suitable for applications requiring high-speed data transmission in compact electronic devices.

Median Price

$46.710

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 49,598 parts In-Stock

1+ parts

$32.008

100+ parts

$28.451

1k+ parts

$20.920

10k+ parts

-

49,598

$32.008

$28.451

$20.920

-

DigiKey

USA . 59 parts In-Stock

1+ parts

$46.710

100+ parts

$33.846

1k+ parts

$32.742

10k+ parts

-

59

$46.710

$33.846

$32.742

-

Mouser Electronics

USA . 8 parts In-Stock

1+ parts

$47.650

100+ parts

$33.850

1k+ parts

$32.740

10k+ parts

-

8

$47.650

$33.850

$32.740

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,650 parts In-Stock

1+ parts

$30.408

100+ parts

-

1k+ parts

-

10k+ parts

-

2,650

$30.408

-

-

-

Vyrian

USA . 8,952 parts In-Stock

1+ parts

-

100+ parts

-

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-

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8,952

-

-

-

-

Chip Stock

USA . 6,700 parts In-Stock

1+ parts

-

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-

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6,700

-

-

-

-

Connector Distribution Corp

USA . 312 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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312

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-

-

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Right Parts Inc.

USA . 312 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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312

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 104 parts In-Stock

1+ parts

$1.071

100+ parts

-

1k+ parts

-

10k+ parts

-

104

$1.071

-

-

-

Northwest PG Solutions

USA . 693 parts In-Stock

1+ parts

$1.178

100+ parts

-

1k+ parts

-

10k+ parts

-

693

$1.178

-

-

-

Parana Technologies

USA . 996 parts In-Stock

1+ parts

$10.341

100+ parts

-

1k+ parts

$10.862

10k+ parts

-

996

$10.341

-

$10.862

-

DigiPath Technology Company

USA . 2,267 parts In-Stock

1+ parts

$11.387

100+ parts

$10.476

1k+ parts

-

10k+ parts

-

2,267

$11.387

$10.476

-

-

ChromeModa Solutions

Germany . 6,046 parts In-Stock

1+ parts

$11.619

100+ parts

$9.528

1k+ parts

-

10k+ parts

-

6,046

$11.619

$9.528

-

-

IDEA Electronic Components Group

UK . 2,051 parts In-Stock

1+ parts

$11.619

100+ parts

$11.038

1k+ parts

$10.457

10k+ parts

-

2,051

$11.619

$11.038

$10.457

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Corphita

USA . 4,647 parts In-Stock

1+ parts

$28.807

100+ parts

-

1k+ parts

-

10k+ parts

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4,647

$28.807

-

-

-

Microchip USA

USA . 1,834 parts In-Stock

1+ parts

$68.040

100+ parts

$66.850

1k+ parts

$66.260

10k+ parts

$65.670

1,834

$68.040

$66.850

$66.260

$65.670

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,000

-

-

-

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A-Z Elektronik GmbH

Germany . 6,959 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,959

-

-

-

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Alle Elektronik GmbH

Germany . 4,639 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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4,639

-

-

-

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Kepictronics

USA . 110 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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110

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-

-

Overview

Unlock the power of high-speed data transmission with the DS250DF410ABMT by Texas Instruments. Designed with precision and expertise, this interface IC offers unparalleled performance and reliability for a wide range of applications. From industrial automation to telecommunications, this product delivers exceptional value, benefits, and advantages to customers seeking top-notch quality and seamless connectivity. Trust in Texas Instruments to provide cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Helps optimize space on the circuit board, making efficient use of available area.

No. of Terminals: 101

Offers a wide range of connectivity options, allowing for versatile integration with other components.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Provides a wide range of operating temperatures, making the product suitable for a variety of environments.

Terminal Finish: TIN SILVER COPPER

Enhances conductivity and corrosion resistance, ensuring stable performance over time.

No. of Channels: 4

Allows for multiple data streams or signals to be processed simultaneously, increasing the product's efficiency.

Moisture Sensitivity Level (MSL): 3

Indicates the product's ability to withstand exposure to moisture during handling and storage, ensuring reliability in various conditions.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing with other circuits or devices, making it a suitable choice for various electronic applications.

Technical Specifications

Other Function Interface ICs DS250DF410ABMT attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B101

JESD-609 Code:

e1

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

101

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.03 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

DS250DF410ABMT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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