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DS250DF410ABMR

Texas Instruments

DS250DF410ABMR by Texas Instruments

DS250DF410ABMR by Texas Instruments is a 4-channel interface IC with a package style of grid array, thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) and has bottom terminal position with tin silver copper finish. Ideal for applications requiring high-speed data transmission in compact electronic devices.

Median Price

$28.948

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,251 parts In-Stock

1+ parts

$28.948

100+ parts

$25.731

1k+ parts

$18.920

10k+ parts

-

10,251

$28.948

$25.731

$18.920

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,774 parts In-Stock

1+ parts

$27.501

100+ parts

-

1k+ parts

-

10k+ parts

-

3,774

$27.501

-

-

-

Vyrian

USA . 7,076 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,076

-

-

-

-

Chip Stock

USA . 2,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,540

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 184 parts In-Stock

1+ parts

$0.236

100+ parts

-

1k+ parts

-

10k+ parts

$0.227

184

$0.236

-

-

$0.227

Northwest PG Solutions

USA . 1,863 parts In-Stock

1+ parts

$0.260

100+ parts

-

1k+ parts

-

10k+ parts

$0.229

1,863

$0.260

-

-

$0.229

Parana Technologies

USA . 362 parts In-Stock

1+ parts

$7.972

100+ parts

-

1k+ parts

$8.547

10k+ parts

-

362

$7.972

-

$8.547

-

DigiPath Technology Company

USA . 1,140 parts In-Stock

1+ parts

$8.778

100+ parts

-

1k+ parts

-

10k+ parts

-

1,140

$8.778

-

-

-

IDEA Electronic Components Group

UK . 1,013 parts In-Stock

1+ parts

$8.957

100+ parts

$8.509

1k+ parts

$8.061

10k+ parts

-

1,013

$8.957

$8.509

$8.061

-

ChromeModa Solutions

Germany . 1,004 parts In-Stock

1+ parts

$8.957

100+ parts

$7.345

1k+ parts

-

10k+ parts

-

1,004

$8.957

$7.345

-

-

AZTECH Wire

Italy . 889 parts In-Stock

1+ parts

$10.020

100+ parts

-

1k+ parts

-

10k+ parts

-

889

$10.020

-

-

-

Corphita

USA . 349 parts In-Stock

1+ parts

$26.053

100+ parts

-

1k+ parts

-

10k+ parts

-

349

$26.053

-

-

-

Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,500

-

-

-

-

Lixinc

USA . 1,648 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,648

-

-

-

-

Overview

The DS250DF410ABMR by Texas Instruments is a high-quality interface IC that offers unparalleled performance and reliability. With Texas Instruments' reputation for excellence in manufacturing, this product is sure to meet and exceed your expectations. Ideal for a wide range of applications, this IC provides fast data transmission and seamless connectivity for your project. Experience the value and benefits of this innovative product, and take your designs to the next level with the DS250DF410ABMR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

No. of Terminals: 101

With a high number of terminals, this IC can support complex functions and provide versatile connectivity options.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can operate reliably in harsh environmental conditions.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure solder joints during assembly, improving the overall reliability.

No. of Channels: 4

Four channels provide flexibility in handling multiple input/output signals or communication paths.

Technical Specifications

Other Function Interface ICs DS250DF410ABMR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B101

JESD-609 Code:

e1

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

101

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.03 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

DS250DF410ABMR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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