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NTB0104UK-Q100Z

NXP Semiconductors

NTB0104UK-Q100Z by NXP Semiconductors

NTB0104UK-Q100Z by NXP Semiconductors is an automotive-grade interface IC with a 12-terminal grid array design. It operates b/w -40 °C to 125 °C and supports power supplies of 1.2/3.6V and 1.8/5V, ideal for automotive applications requiring reliability. Its AEC-Q100 screening ensures high performance in demanding environments.

Median Price

$0.854

Lifecycle Status

EOL

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 880 parts In-Stock

1+ parts

$2.310

100+ parts

$1.022

1k+ parts

$0.829

10k+ parts

-

880

$2.310

$1.022

$0.829

-

Rochester

USA . 289,280 parts In-Stock

1+ parts

-

100+ parts

$0.823

1k+ parts

$0.683

10k+ parts

$0.609

289,280

-

$0.823

$0.683

$0.609

Verical

USA . 215,000 parts In-Stock

1+ parts

-

100+ parts

-

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$0.854

10k+ parts

$0.761

215,000

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-

$0.854

$0.761

Distributors (In-Stock)

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Digiode

USA . 248 parts In-Stock

1+ parts

$0.641

100+ parts

-

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248

$0.641

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Flip Electronics

USA . 185,000 parts In-Stock

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185,000

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Vyrian

USA . 3,070 parts In-Stock

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3,070

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Anansix

USA . 2,157 parts In-Stock

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2,157

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Distributors (Availability)

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Corphita

USA . 3,731 parts In-Stock

1+ parts

$0.608

100+ parts

-

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3,731

$0.608

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Vigor

Singapore . 293 parts In-Stock

1+ parts

$1.240

100+ parts

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293

$1.240

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QUARKTWIN TECHNOLOGY LTD

USA . 23,830 parts In-Stock

1+ parts

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23,830

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Microchip USA

USA . 9,667 parts In-Stock

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9,667

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UNI Independent Distributors

Spain . 8,049 parts In-Stock

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8,049

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 168 parts In-Stock

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168

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Overview

Elevate your automotive designs with the NTB0104UK-Q100Z from NXP Semiconductors, a trusted leader in high-quality semiconductor solutions. This advanced interface IC offers exceptional reliability in demanding environments, ensuring optimal performance even in extreme temperatures. Tailored for automotive applications, it enhances connectivity and efficiency, providing peace of mind and innovation to engineers. Choose NXP for unparalleled quality and transformative technology that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability, making it suitable for automotive applications.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient use of PCB space, enhancing overall device performance.

Screening Level: AEC-Q100

Being AEC-Q100 qualified indicates the product meets rigorous automotive standards, ensuring dependability in critical automotive environments.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for space efficiency and effective thermal management.

Power Supplies (V): 1.2/3.6, 1.8/5

The flexible power supply range allows compatibility with a wide array of systems and enhances versatility in design.

No. of Terminals: 12

Having 12 terminals provides the necessary connectivity options for complex interface requirements.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch design facilitate high-density interconnections, ideal for advanced electronic applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable function even in challenging thermal environments encountered in automotive systems.

Minimum Operating Temperature: -40 °C

A wide temperature range guarantees performance in extreme cold conditions, essential for outdoor automotive applications.

Terminal Position: BOTTOM

Bottom terminal positioning aids in efficient layout and ensures stable connections on the PCB.

Temperature Grade: AUTOMOTIVE

Being graded for automotive use indicates enhanced reliability and longevity in harsh automotive environments.

Terminal Form: BALL

Ball-shaped terminals contribute to improved solder joint strength and reliability during assembly.

Terminal Pitch: 0.4 mm

The 0.4 mm terminal pitch allows for high-density packaging, making it suitable for compact electronic designs.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, it plays a crucial role in enabling communication between different components of a system, enhancing overall functionality.

Technical Specifications

Other Function Interface ICs NTB0104UK-Q100Z attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PBGA-B12

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA12,3X4,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.2/3.6,1.8/5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Other Interface ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Trade Compliance

NTB0104UK-Q100Z Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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