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NTB0102GD-Q100H

NXP Semiconductors

NTB0102GD-Q100H by NXP Semiconductors

NTB0102GD-Q100H by NXP Semiconductors is an automotive interface IC designed for robust performance. It operates within a temperature range of -40 °C to 125 °C and supports power supplies from 1.2V to 5V. This compact, surface-mount device features an AEC-Q100 screening level for reliability in automotive applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Flip Electronics

USA . 390,000 parts In-Stock

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390,000

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Vyrian

USA . 5,245 parts In-Stock

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5,245

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Digiode

USA . 2,912 parts In-Stock

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2,912

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Anansix

USA . 2,200 parts In-Stock

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2,200

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Microchip USA

USA . 167 parts In-Stock

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$0.848

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167

$0.848

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One Stop Electronics

USA . 476 parts In-Stock

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$1.500

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476

$1.500

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AZTECH Wire

Italy . 264 parts In-Stock

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$19.600

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264

$19.600

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QUARKTWIN TECHNOLOGY LTD

USA . 7,148 parts In-Stock

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7,148

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Corphita

USA . 3,903 parts In-Stock

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UNI Independent Distributors

Spain . 2,794 parts In-Stock

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2,794

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Vigor

Singapore . 322 parts In-Stock

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322

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Overview

Elevate your designs with the NTB0102GD-Q100H from NXP Semiconductors, a trusted leader in cutting-edge technology. This high-performance interface IC ensures exceptional reliability across automotive applications, operating seamlessly from -40 °C to 125 °C. With its compact design and advanced features, you gain enhanced efficiency and durability for your projects, making it the perfect choice for engineers seeking quality and innovation without compromise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into modern electronic circuits.

Screening Level: AEC-Q100

Complying with AEC-Q100 ensures high reliability and performance in automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCBs, making it easier to design and layout electronic devices.

Power Supplies (V): 1.2/3.6, 1.8/5

Supports multiple voltage ranges, allowing versatility in different circuit designs and power supply configurations.

No. of Terminals: 8

With 8 terminals, it provides sufficient connectivity for a variety of functions without excessive complexity.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, facilitating compact assembly.

Maximum Operating Temperature: 125 °C

It can operate under high temperatures, making it reliable for use in harsh environments.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures functionality in extreme conditions, essential for automotive applications.

Terminal Position: DUAL

Dual terminal position enhances the stability of electrical connections, reducing the risk of failures.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates compatibility with advanced soldering processes, ensuring secure mounting.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this temperature grade ensures reliability and performance under automotive stress.

Terminal Form: NO LEAD

No lead design allows for better thermal performance and easier handling during assembly and manufacturing.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for a compact layout, facilitating integration in high-density applications.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC type, it provides essential connectivity functions for improved system communication.

Technical Specifications

Other Function Interface ICs NTB0102GD-Q100H attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-N8

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.6,1.8/5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Other Interface ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

NTB0102GD-Q100H Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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