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NVT4857UKZ

NXP Semiconductors

NVT4857UKZ by NXP Semiconductors

NXP Semiconductors' NVT4857UKZ is a 20-terminal interface IC with a supply voltage range of 2.9V to 3.6V, suitable for industrial applications. It features a very thin profile package style and operates b/w -40°C to 85°C. The IC is designed for surface mount assembly and has a rectangular shape with a grid array package body material made of plastic/epoxy.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,237 parts In-Stock

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Digiode

USA . 3,343 parts In-Stock

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Anansix

USA . 1,329 parts In-Stock

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1,329

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Corohmni

South Africa . 60 parts In-Stock

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$3.807

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60

$3.807

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One Stop Electronics

USA . 402 parts In-Stock

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$5.500

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Ampacity Inc.

Singapore . 143 parts In-Stock

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$5.500

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Aztec Data Supply Inc.

USA . 143 parts In-Stock

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$11.910

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AZTECH Wire

Italy . 773 parts In-Stock

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$17.264

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Semicontronic

India . 1,419 parts In-Stock

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$35.500

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$34.612

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$34.435

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$34.435

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QUARKTWIN TECHNOLOGY LTD

USA . 25,162 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 4,717 parts In-Stock

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UNI Independent Distributors

Spain . 3,860 parts In-Stock

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Continental Prestige Electronics

USA . 2,451 parts In-Stock

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Argo Parts USA

USA . 1,842 parts In-Stock

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Corphita

USA . 1,360 parts In-Stock

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Vigor

Singapore . 526 parts In-Stock

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526

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the NVT4857UKZ by NXP Semiconductors. This top-of-the-line interface circuit offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. With applications across a wide range of industries, this product delivers exceptional value, providing customers with seamless integration and optimal performance. Experience the benefits of cutting-edge technology with the NVT4857UKZ and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in IC packages for its durability and heat resistance, making the product suitable for a wide range of industrial applications.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation of the IC onto a PCB, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows the IC to operate reliably in a wide range of voltage conditions, increasing its versatility.

Package Shape: RECTANGULAR

Rectangular package shapes are common and easier to handle during PCB layout and assembly, ensuring compatibility with standard design practices.

No. of Terminals: 20

With a sufficient number of terminals, the IC can accommodate multiple connections and functions, making it a versatile option for different applications.

Minimum Supply Voltage: 2.9 V

The low minimum supply voltage requirement ensures that the IC can still operate within a safe range even under low voltage conditions, enhancing its reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the IC to perform reliably in elevated temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the IC can function efficiently even in cold environments, increasing its usability in a variety of settings.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB layout and routing, enabling efficient signal flow and reducing the risk of interference or signal loss.

Maximum Seated Height: 0.53 mm

The slim profile of the IC allows for compact and space-saving designs, making it suitable for applications where size constraints are a consideration.

Width: 1.7 mm

The narrow width of the IC contributes to its overall compact size, facilitating integration into tight spaces or densely populated PCB layouts.

Length: 2.1 mm

The short length of the IC further enhances its compact form factor, allowing for efficient use of board space and reducing the overall footprint of the product.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures that the IC can withstand harsh environmental conditions typically encountered in industrial settings, enhancing its durability and longevity.

Terminal Form: BALL

Ball terminals provide reliable connections and enable easy soldering during assembly, ensuring secure and stable electrical connections for the IC.

Nominal Supply Voltage: 3 V

The nominal supply voltage specification indicates the standard operating voltage for the IC, simplifying power supply design and compatibility considerations.

Terminal Pitch: 0.4 mm

The fine terminal pitch allows for high-density mounting of the IC on a PCB, maximizing use of board space and enabling complex circuit designs without sacrificing performance.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication and data transfer between different components or systems, making it a critical component for enabling seamless connectivity in various applications.

Technical Specifications

Other Function Interface ICs NVT4857UKZ attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PBGA-B20

Length:

2.1 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.53 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.9 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

1.7 mm

Trade Compliance

NVT4857UKZ Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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