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NVT4556BUKZ

NXP Semiconductors

NVT4556BUKZ by NXP Semiconductors

NXP Semiconductors' NVT4556BUKZ is a 12-terminal interface IC with a package style of grid array, very thin profile, and fine pitch. It operates b/w -40 to 85 °C with a supply voltage range of 1.55V to 3.6V, making it ideal for industrial applications requiring precise signal interfacing in compact spaces.

Median Price

$0.922

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,957 parts In-Stock

1+ parts

-

100+ parts

$0.888

1k+ parts

$0.737

10k+ parts

$0.657

3,957

-

$0.888

$0.737

$0.657

DigiKey

USA . 3,957 parts In-Stock

1+ parts

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$1.110

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3,957

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$1.110

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Verical

USA . 3,957 parts In-Stock

1+ parts

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100+ parts

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$0.922

10k+ parts

$0.822

3,957

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-

$0.922

$0.822

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,541 parts In-Stock

1+ parts

$0.693

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3,541

$0.693

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Vyrian

USA . 205 parts In-Stock

1+ parts

$0.729

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205

$0.729

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Anansix

USA . 1,800 parts In-Stock

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1,800

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Netsource Technology, Inc.

USA . 1,097 parts In-Stock

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1,097

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Distributors (Availability)

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Corphita

USA . 3,748 parts In-Stock

1+ parts

$0.656

100+ parts

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3,748

$0.656

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Component Stockers USA

USA . 5,717 parts In-Stock

1+ parts

$0.740

100+ parts

$0.690

1k+ parts

$0.630

10k+ parts

-

5,717

$0.740

$0.690

$0.630

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Vigor

Singapore . 544 parts In-Stock

1+ parts

$1.200

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544

$1.200

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Microchip USA

USA . 294 parts In-Stock

1+ parts

$1.380

100+ parts

$1.380

1k+ parts

$1.380

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$1.380

294

$1.380

$1.380

$1.380

$1.380

Kepictronics

USA . 16,000 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,957 parts In-Stock

1+ parts

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100+ parts

$0.870

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3,957

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$0.870

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UNI Independent Distributors

Spain . 2,233 parts In-Stock

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Lixinc

USA . 1,653 parts In-Stock

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1,653

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Perfect Parts

USA . 560 parts In-Stock

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560

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Overview

Elevate your electronic devices to new heights with the NVT4556BUKZ by NXP Semiconductors. Crafted with precision and expertise, this innovative interface circuit offers seamless connectivity and enhanced functionality for a wide range of applications. From industrial settings to consumer electronics, this quality product ensures reliable performance and optimal efficiency. With a compact design and advanced features, the NVT4556BUKZ provides unmatched value and benefits for customers seeking superior interface solutions. Experience the difference with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and thermal stability, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into circuit boards.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for compatibility with a wide range of power sources.

Package Shape: RECTANGULAR

Rectangular package shape enables efficient use of space on circuit boards.

No. of Terminals: 12

Having 12 terminals provides flexibility in connecting to other components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with a thin profile and fine pitch enhances signal integrity and reduces crosstalk.

Minimum Supply Voltage: 1.55 V

Lower minimum supply voltage allows for operation in low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables functionality in cold environments.

Terminal Position: BOTTOM

Bottom terminal position simplifies board layout and assembly process.

Maximum Seated Height: 0.412 mm

Low maximum seated height reduces overall profile and space requirements in compact designs.

Width: 1.205 mm

Narrow width facilitates placement in crowded circuits while optimizing board real estate.

Length: 1.605 mm

Compact length allows for space-efficient integration without sacrificing functionality.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments.

Terminal Form: BALL

Ball terminals offer secure contact and facilitate easy soldering for reliable connections.

Nominal Supply Voltage: 1.8 V

Nominal supply voltage provides a stable operating point for consistent performance.

Terminal Pitch: 0.4 mm

Fine terminal pitch enables high-density mounting and enhances signal integrity.

Interface IC Type: INTERFACE CIRCUIT

Designed for interface circuit applications, making it suitable for various connectivity solutions.

Technical Specifications

Other Function Interface ICs NVT4556BUKZ attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PBGA-B12

Length:

1.605 mm

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.412 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.205 mm

Trade Compliance

NVT4556BUKZ Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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