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ST6G3240TBR

STMicroelectronics

ST6G3240TBR by STMicroelectronics

ST6G3240TBR from STMicroelectronics is a CMOS interface IC designed for industrial applications. It operates b/w 1.4V and 3.6V, with a max temp of 85 °C and features a compact 36-terminal grid array package. Ideal for space-constrained environments, it ensures reliable performance in demanding conditions.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 7,909 parts In-Stock

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A&K Electronics

USA . 2,670 parts In-Stock

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Bristol Electronics

USA . 2,670 parts In-Stock

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2,670

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Rotakorn

Sweden . 2,605 parts In-Stock

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Digiode

USA . 2,056 parts In-Stock

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Anansix

USA . 1,220 parts In-Stock

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IDEA Electronic Components Group

UK . 253 parts In-Stock

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$9.126

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$8.214

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AZTECH Wire

Italy . 660 parts In-Stock

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$10.220

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MKK Technologies

India . 1,853 parts In-Stock

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$17.162

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DigiPath Technology Company

USA . 1,853 parts In-Stock

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Microchip USA

USA . 435 parts In-Stock

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$18.647

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A-Z Elektronik GmbH

Germany . 4,605 parts In-Stock

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Kepictronics

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Vigor

Singapore . 3,030 parts In-Stock

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Corphita

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Parana Technologies

USA . 363 parts In-Stock

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$10.912

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Overview

Unlock unparalleled performance and reliability with the ST6G3240TBR from STMicroelectronics. Renowned for their commitment to innovation, STMicroelectronics ensures this interface IC excels in demanding environments, making it perfect for industrial automation, IoT applications, and more. With a slim profile and robust design, it seamlessly integrates into your projects, enhancing efficiency while providing exceptional value. Experience quality you can trust, backed by a leader in semiconductor excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures the product has a robust design, which enhances reliability and long-term performance.

Surface Mount: YES

Surface mount technology allows for efficient use of space on printed circuit boards, facilitating more compact designs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V makes this IC versatile and compatible with a wide range of applications, enhancing design flexibility.

Package Shape: SQUARE

The square shape of the package aids in efficient layout and thermal management, making it suitable for various design configurations.

No. of Terminals: 36

With 36 terminals, this IC offers ample connectivity options, allowing for complex configurations and expanded functionality.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The thin profile and fine pitch of the grid array package make it ideal for high-density applications, promoting space efficiency.

Minimum Supply Voltage: 1.4 V

A low minimum supply voltage of 1.4 V ensures power efficiency, making this IC suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

Operating at up to 85 °C ensures reliability in industrial environments, making this IC a good choice for harsh conditions.

Minimum Operating Temperature: -40 °C

The ability to function at temperatures as low as -40 °C enhances its usability in extreme weather applications.

Terminal Position: BOTTOM

Bottom-terminal positioning optimizes space utilization on PCBs and improves ease of soldering during assembly.

Maximum Seated Height: 1.16 mm

A low seated height allows for a compact design, which is beneficial in applications with space constraints.

Width: 3.6 mm

A small width of 3.6 mm contributes to compact PCB layouts, making it ideal for miniaturized electronic devices.

Length: 3.6 mm

The equal length of 3.6 mm maintains a balanced footprint, facilitating uniform layout design in multi-IC applications.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this IC is designed to handle rigorous conditions, ensuring durability and reliability in critical applications.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making it ideal for modern high-performance circuits.

Terminal Form: BALL

Ball terminal form enhances solderability and reduces mechanical stress, ensuring stable connections and improved manufacturing efficiency.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V promotes energy efficiency, vital for low-power applications and extending battery life.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density mounting on PCBs, maximizing the number of devices in a limited area.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit, this IC enables seamless communication between different system components, enhancing overall system integration.

Technical Specifications

Other Function Interface ICs ST6G3240TBR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B36

Length:

3.6 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.16 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.6 mm

Trade Compliance

ST6G3240TBR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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