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ST6G3238BE

STMicroelectronics

ST6G3238BE by STMicroelectronics

ST6G3238BE by STMicroelectronics is a CMOS interface IC designed for industrial applications, operating b/w -40 °C and 85 °C. It features a compact 25-terminal grid array with a max supply voltage of 3.6V and a thin profile of just 1.16mm height. Ideal for space-constrained environments, it ensures reliable performance in demanding conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,675 parts In-Stock

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3,675

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Anansix

USA . 736 parts In-Stock

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736

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Digiode

USA . 474 parts In-Stock

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474

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 172 parts In-Stock

1+ parts

$2.752

100+ parts

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$2.477

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172

$2.752

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$2.477

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MKK Technologies

India . 1,271 parts In-Stock

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$5.174

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1,271

$5.174

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DigiPath Technology Company

USA . 1,271 parts In-Stock

1+ parts

$5.174

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1,271

$5.174

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Parana Technologies

USA . 2,361 parts In-Stock

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$3.290

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2,361

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$3.290

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Corphita

USA . 1,083 parts In-Stock

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1,083

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Overview

Elevate your projects with the ST6G3238BE from STMicroelectronics, a leader in innovative semiconductor solutions. This robust interface IC combines exceptional quality and reliability with versatile applications, making it ideal for industrial automation, consumer electronics, and beyond. Its thin profile and surface mount design ensure seamless integration into compact designs, delivering outstanding performance even in extreme conditions. Experience unmatched value and efficiency that empower your next breakthrough!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body offers excellent mechanical strength and protection, ensuring reliable performance in various environments.

Surface Mount: YES

Surface mount technology allows for compact design and efficient assembly on PCBs, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V expands its compatibility with various power systems while maintaining safe operation.

Package Shape: SQUARE

The square package shape allows for a more efficient use of PCB space, which can facilitate higher component density.

No. of Terminals: 25

With 25 terminals, this IC provides ample interface options for connecting multiple signals, enhancing flexibility in design.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This packaging style allows for a thin profile and fine pitch, which can significantly reduce the overall size of the circuit while maintaining performance.

Minimum Supply Voltage: 1.4 V

The low minimum supply voltage makes this IC suitable for battery-powered applications, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in moderately harsh environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is well-suited for use in extreme conditions, further expanding application possibilities.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient thermal management and effective signal integrity, making it ideal for high-performance applications.

Maximum Seated Height: 1.16 mm

The low seated height minimizes the profile of the component, aiding in the development of slimmer devices.

Width: 3 mm

A 3 mm width keeps the component compact, supporting high-density designs that are becoming increasingly popular in electronics.

Length: 3 mm

The 3 mm length further complements the compact design, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Having an industrial temperature grade ensures durability and reliability in a wide range of industrial applications.

Technology: CMOS

The CMOS technology used in this IC offers low power consumption and high noise immunity, making it ideal for portable and high-performance applications.

Terminal Form: BALL

Ball terminal form allows for solid mechanical connections and facilitates effective heat dissipation, benefiting overall performance.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V is standard for many systems, ensuring compatibility with common electronic components.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch supports fine pitch designs, which are crucial for high-density electronic assemblies.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, it is specifically designed to ensure smooth data communication between various components, enhancing system performance.

Technical Specifications

Other Function Interface ICs ST6G3238BE attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B25

Length:

3 mm

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.16 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

ST6G3238BE Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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