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ST6G3237BTBR

STMicroelectronics

ST6G3237BTBR by STMicroelectronics

ST6G3237BTBR from STMicroelectronics is a CMOS interface IC designed for industrial applications. It operates b/w 1.4V and 3.6V, with a max temp of 85 °C and features a compact 25-terminal grid array package. Ideal for space-constrained environments, it ensures reliable performance in harsh conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,685 parts In-Stock

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7,685

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Digiode

USA . 3,436 parts In-Stock

1+ parts

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3,436

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Anansix

USA . 2,392 parts In-Stock

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2,392

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,010 parts In-Stock

1+ parts

$4.150

100+ parts

-

1k+ parts

$3.735

10k+ parts

-

2,010

$4.150

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$3.735

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Microchip USA

USA . 419 parts In-Stock

1+ parts

$5.425

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419

$5.425

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MKK Technologies

India . 1,574 parts In-Stock

1+ parts

$7.804

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1,574

$7.804

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DigiPath Technology Company

USA . 1,574 parts In-Stock

1+ parts

$7.804

100+ parts

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1,574

$7.804

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AZTECH Wire

Italy . 1,040 parts In-Stock

1+ parts

$8.250

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1,040

$8.250

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Vigor

Singapore . 4,651 parts In-Stock

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4,651

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Parana Technologies

USA . 1,380 parts In-Stock

1+ parts

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100+ parts

$4.962

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1,380

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$4.962

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Corphita

USA . 591 parts In-Stock

1+ parts

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591

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Overview

Unlock unparalleled performance with the ST6G3237BTBR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This compact interface IC is designed for versatility and reliability, operating seamlessly in diverse industrial applications. With its robust temperature range and efficient power management, it elevates your designs while ensuring longevity and efficiency. Choose STMicroelectronics for quality you can depend on—empower your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of board space, essential for modern electronics.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V gives users flexibility in power supply options, accommodating a wider range of devices.

Package Shape: SQUARE

The square shape enhances layout options and component density on PCBs, optimizing performance in tight spaces.

No. of Terminals: 25

With 25 terminals, the product offers multiple connectivity options, which is advantageous for complex circuit designs.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This style supports high-density mounting and improves thermal performance, making it ideal for both space-constrained and high-performance applications.

Minimum Supply Voltage: 1.4 V

A low minimum supply voltage allows for energy-efficient designs, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures makes it suitable for industrial and demanding environments, ensuring reliability.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this product can function effectively in extreme conditions, enhancing its versatility.

Terminal Position: BOTTOM

Bottom terminal positioning is advantageous for thermal management, aiding in heat dissipation during operation.

Maximum Seated Height: 1.16 mm

A low seated height ensures compatibility with other low-profile components, maintaining a slim design for the overall assembly.

Width: 3 mm

A compact width helps in minimizing the overall footprint of the electronic design, crucial for modern portable devices.

Length: 3 mm

The small length contributes to the overall size reduction, allowing for tighter layouts without sacrificing functionality.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this component ensures robustness and reliability in harsh conditions.

Technology: CMOS

CMOS technology allows for lower power consumption and higher density of logic functions, boosting performance in various electronic applications.

Terminal Form: BALL

Ball terminals provide secure connections and facilitate easier soldering processes, improving overall assembly quality.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V balances performance and power efficiency, making it ideal for many digital applications.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for closer terminal placement, enabling higher-density and more compact configurations.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit, this product is essential for facilitating communication between different components, enhancing system integration.

Technical Specifications

Other Function Interface ICs ST6G3237BTBR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B25

Length:

3 mm

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.16 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

ST6G3237BTBR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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