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ST6G3237TTR

STMicroelectronics

ST6G3237TTR by STMicroelectronics

ST6G3237TTR from STMicroelectronics is a CMOS interface IC designed for industrial applications. It operates b/w 1.4V and 3.6V, with a max temp of 85 °C and features a compact 20-terminal SOIC package. Ideal for space-constrained environments, it ensures reliable performance in harsh conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,106 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,106

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Vyrian

USA . 2,355 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,355

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-

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Anansix

USA . 1,597 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,597

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,065 parts In-Stock

1+ parts

$11.737

100+ parts

-

1k+ parts

$10.564

10k+ parts

-

2,065

$11.737

-

$10.564

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MKK Technologies

India . 2,034 parts In-Stock

1+ parts

$22.071

100+ parts

-

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10k+ parts

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2,034

$22.071

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DigiPath Technology Company

USA . 2,034 parts In-Stock

1+ parts

$22.071

100+ parts

-

1k+ parts

-

10k+ parts

-

2,034

$22.071

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-

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Corphita

USA . 1,698 parts In-Stock

1+ parts

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1,698

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Parana Technologies

USA . 1,520 parts In-Stock

1+ parts

-

100+ parts

$14.034

1k+ parts

-

10k+ parts

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1,520

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$14.034

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Overview

Unlock unparalleled performance with the ST6G3237TTR from STMicroelectronics, a premier choice in the realm of interface ICs. Renowned for their commitment to quality and innovation, STMicroelectronics ensures this compact, durable solution excels in demanding applications across industries. With its robust temperature range and efficient power management, the ST6G3237TTR empowers your designs, delivering reliability and enhanced functionality that drives success. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures excellent protection for the IC, increasing its reliability and longevity in various applications.

Surface Mount: YES

Being surface mount allows for smaller PCB designs and higher density component placement, making this IC ideal for compact electronic devices.

Maximum Supply Voltage: 3.6 V

The 3.6 V maximum supply voltage offers flexibility in powering the device while maintaining compatibility with various power sources.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on the PCB, facilitating efficient layout designs.

No. of Terminals: 20

With 20 terminals, it provides ample connection options for complex functions, enhancing its versatility in diverse applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This small and thin profile package style is ideal for high-density applications and helps save space on PCBs.

Minimum Supply Voltage: 1.4 V

A low minimum supply voltage of 1.4 V makes it energy-efficient and suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

The capability to operate at temperatures up to 85 °C ensures reliability in demanding environments and industrial applications.

Minimum Operating Temperature: -40 °C

An extensive operating temperature range down to -40 °C guarantees functionality in extreme conditions, broadening its application range.

Terminal Position: DUAL

Dual terminal positioning allows for robust connections and simplifies PCB design, enhancing installation flexibility.

Maximum Seated Height: 1.2 mm

A low seated height profile allows for more compact designs and compatibility with various electronic enclosures.

Width: 4.4 mm

With a width of only 4.4 mm, this IC is perfect for space-constrained applications, ensuring a smaller overall device footprint.

Length: 6.5 mm

The length of 6.5 mm is optimal for fitting into tight spaces on PCBs, enabling efficient use of available area.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability in harsh conditions, making it suitable for industrial and automotive uses.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making this IC efficient for modern applications.

Terminal Form: GULL WING

The gull wing terminal form ensures easy soldering and strong mechanical connection, which is vital for maintaining solid performance over time.

Nominal Supply Voltage: 1.8 V

The 1.8 V nominal supply voltage balances power efficiency and performance, making this IC ideal for low-power applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is suitable for high-density layouts, allowing manufacturers to save space without compromising functionality.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit, this IC can manage communication between different components, enhancing system integration and functionality.

Technical Specifications

Other Function Interface ICs ST6G3237TTR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

ST6G3237TTR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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