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ST6G3237TBR

STMicroelectronics

ST6G3237TBR by STMicroelectronics

ST6G3237TBR by STMicroelectronics is a 25-terminal interface IC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.4V to 3.6V. Designed for industrial applications, it features a thin profile grid array package suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,591 parts In-Stock

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Anansix

USA . 2,644 parts In-Stock

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Digiode

USA . 529 parts In-Stock

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529

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Distributors (Availability)

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AZTECH Wire

Italy . 886 parts In-Stock

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$6.924

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886

$6.924

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IDEA Electronic Components Group

UK . 445 parts In-Stock

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$7.138

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$6.424

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445

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$6.424

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MKK Technologies

India . 2,212 parts In-Stock

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$13.423

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$13.423

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DigiPath Technology Company

USA . 2,212 parts In-Stock

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$13.423

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$13.423

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Microchip USA

USA . 246 parts In-Stock

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$18.175

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Ampacity Inc.

Singapore . 615 parts In-Stock

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$19.500

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615

$19.500

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Vigor

Singapore . 6,890 parts In-Stock

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Corphita

USA . 2,169 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,100 parts In-Stock

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Parana Technologies

USA . 486 parts In-Stock

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$8.535

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Aranea Global

USA . 50 parts In-Stock

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Overview

Discover the ST6G3237TBR by STMicroelectronics, a top-tier manufacturer known for delivering premium quality products. This innovative interface IC falls under the category of Other Function Interface ICs, offering customers a wide range of applications. With a robust package body material and a compact square shape, this product ensures reliability and durability. The ST6G3237TBR boasts a low minimum supply voltage and a high maximum operating temperature, making it ideal for industrial use. Experience seamless connectivity and superior performance with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making it suitable for industrial applications.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources, giving flexibility in usage scenarios.

Package Shape: SQUARE

Facilitates a compact design and efficient use of space on the circuit board.

Minimum Supply Voltage: 1.4 V

Allows the product to operate even under low power conditions, increasing its versatility.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a variety of environmental conditions, making it suitable for industrial settings.

Minimum Operating Temperature: -40 °C

Can withstand extreme cold temperatures, enhancing its usability in diverse applications.

Terminal Position: BOTTOM

Facilitates easy connectivity with other components on the circuit board for seamless integration.

Maximum Seated Height: 1.16 mm

Allows for a low-profile design, which can be beneficial for space-constrained applications.

Width: 3 mm

Compact size enables efficient use of space on the circuit board and easy placement in various electronic devices.

Length: 3 mm

Compact size enables efficient use of space on the circuit board and easy placement in various electronic devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation in demanding conditions.

Technology: CMOS

Utilizes low power consumption CMOS technology for efficient energy usage and improved performance.

Nominal Supply Voltage: 1.8 V

Optimal supply voltage for stable operation and performance of the interface IC.

Terminal Pitch: 0.5 mm

Fine pitch spacing allows for high-density mounting on the circuit board, ideal for compact electronic designs.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing different components or systems, making it a versatile and functional choice.

Technical Specifications

Other Function Interface ICs ST6G3237TBR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B25

Length:

3 mm

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.16 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

ST6G3237TBR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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