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ISO7741FDWR

Texas Instruments

ISO7741FDWR by Texas Instruments

ISO7741FDWR by Texas Instruments is a CMOS interface IC with 4 channels. It operates b/w -55 to 125 °C and has a supply voltage range of 2.25-5.5 V, making it suitable for military-grade applications requiring small outline packaging and surface mount technology.

Median Price

$2.239

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,121 parts In-Stock

1+ parts

$1.911

100+ parts

$1.578

1k+ parts

$0.853

10k+ parts

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7,121

$1.911

$1.578

$0.853

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Arrow

USA . 1,160 parts In-Stock

1+ parts

$2.567

100+ parts

$1.694

1k+ parts

$1.607

10k+ parts

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1,160

$2.567

$1.694

$1.607

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Mouser Electronics

USA . 74 parts In-Stock

1+ parts

$3.680

100+ parts

$2.220

1k+ parts

$1.970

10k+ parts

$1.880

74

$3.680

$2.220

$1.970

$1.880

Verical

USA . 1,160 parts In-Stock

1+ parts

-

100+ parts

$1.694

1k+ parts

$1.607

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1,160

-

$1.694

$1.607

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Distributors (In-Stock)

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Digiode

USA . 3,354 parts In-Stock

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$1.815

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3,354

$1.815

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Nova Conductors

Japan . 870 parts In-Stock

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$1.983

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870

$1.983

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Chip Stock

USA . 41,300 parts In-Stock

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Cyclops Electronics Ltd

UK . 4,837 parts In-Stock

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Vyrian

USA . 3,289 parts In-Stock

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3,289

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Component Sense

UK . 2,171 parts In-Stock

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ComSIT Distribution GmbH

Germany . 647 parts In-Stock

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647

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Sensible Micro Corp

USA . 600 parts In-Stock

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600

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VRG Components

USA . 500 parts In-Stock

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500

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Distributors (Availability)

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Semicontronic

India . 3,512 parts In-Stock

1+ parts

$1.620

100+ parts

$1.580

1k+ parts

$1.571

10k+ parts

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3,512

$1.620

$1.580

$1.571

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Ampacity Inc.

Singapore . 3,476 parts In-Stock

1+ parts

$1.620

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3,476

$1.620

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Corphita

USA . 2,219 parts In-Stock

1+ parts

$1.720

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2,219

$1.720

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Continental Prestige Electronics

USA . 3,407 parts In-Stock

1+ parts

$1.983

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$1.943

3,407

$1.983

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-

$1.943

Argo Parts USA

USA . 1,571 parts In-Stock

1+ parts

$1.983

100+ parts

-

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1,571

$1.983

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.983

100+ parts

-

1k+ parts

$1.884

10k+ parts

$1.844

1,000

$1.983

-

$1.884

$1.844

Corohmni

South Africa . 294 parts In-Stock

1+ parts

$2.040

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294

$2.040

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Parana Technologies

USA . 2,274 parts In-Stock

1+ parts

$2.052

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1k+ parts

$2.574

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2,274

$2.052

-

$2.574

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$2.101

100+ parts

$1.996

1k+ parts

$1.996

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1,000

$2.101

$1.996

$1.996

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ChromeModa Solutions

Germany . 6,894 parts In-Stock

1+ parts

$2.306

100+ parts

$1.891

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6,894

$2.306

$1.891

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IDEA Electronic Components Group

UK . 789 parts In-Stock

1+ parts

$2.306

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$2.075

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789

$2.306

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$2.075

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GreenTree Electronics

Israel . 24,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,138 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

USA . 2,240 parts In-Stock

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Futuretech Components

Singapore . 2,000 parts In-Stock

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DigiPath Technology Company

USA . 1,465 parts In-Stock

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$2.079

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$2.079

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Lixinc

USA . 1,383 parts In-Stock

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1,383

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Metaverse IC Inc.

Canada . 1,002 parts In-Stock

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A-Z Elektronik GmbH

Germany . 534 parts In-Stock

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534

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

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$2.450

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$2.450

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$2.450

250

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$2.450

$2.450

$2.450

Overview

Unlock the potential of your electronic designs with the ISO7741FDWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. The ISO7741FDWR falls under the category of Other Function Interface ICs, offering 4 functions in one compact package. With a wide operating temperature range and dual terminal position, this interface circuit is suitable for a variety of applications. Experience the value and benefits of Texas Instruments' cutting-edge technology with the ISO7741FDWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

Supports a wide range of voltage inputs, making the product versatile for various applications.

No. of Functions: 4

Having multiple functions in one IC reduces the need for additional components, saving cost and board space.

Package Shape: RECTANGULAR

Rectangular shape is standard and easy to handle, fitting well with other components on a circuit board.

No. of Terminals: 16

Sufficient terminals for connecting to other components, enabling complex circuit configurations.

Package Style (Meter): SMALL OUTLINE

Compact size saves space on the circuit board, suitable for applications where size constraints are a concern.

Minimum Supply Voltage: 2.25 V

Supports low voltage operation, making the product energy efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring stable performance in harsh operating conditions.

Minimum Operating Temperature: -55 °C

Capable of operating in extremely cold environments, expanding the range of applications for the product.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish provides good conductivity and corrosion resistance, enhancing the reliability and longevity of the connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting options, allowing for different orientations on the circuit board.

Maximum Seated Height: 2.65 mm

Low profile design helps with space constraints and allows for compact and slim device designs.

Width: 7.5 mm

Narrow width saves space on the circuit board, enabling dense packing of components for increased functionality.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during soldering processes, ensuring reliable and secure connections.

Length: 10.3 mm

Standard length for easy integration into different circuit board layouts and designs.

Temperature Grade: MILITARY

Military-grade temperature range ensures reliability and performance in rugged environments and critical applications.

No. of Channels: 4

Multiple channels allow for parallel operation or processing of different signals, increasing the versatility of the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals provide secure mechanical and electrical connections, suitable for surface mounting on PCBs.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for consistent performance, ensuring reliable operation of the product.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration and compatibility with other components and PCB layouts.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates moderate sensitivity to moisture, suitable for standard assembly and storage conditions.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing functions, ensuring seamless communication between different components in a system.

Technical Specifications

Other Function Interface ICs ISO7741FDWR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

ISO7741FDWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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