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NTS0104UK-Q100Z

NXP Semiconductors

NTS0104UK-Q100Z by NXP Semiconductors

The NXP Semiconductors NTS0104UK-Q100Z is an AEC-Q100 compliant interface IC with 12 terminals in a grid array package. Operating temperature range from -40 to 125°C, suitable for automotive applications. Features include power supplies of 1.8/3.3V and 2.5/5V, surface mount compatibility, and a rectangular package shape.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 4,007 parts In-Stock

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Digiode

USA . 3,467 parts In-Stock

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Anansix

USA . 219 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Corohmni

South Africa . 6 parts In-Stock

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$2.324

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Aztec Data Supply Inc.

USA . 269 parts In-Stock

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$3.540

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Microchip USA

USA . 109 parts In-Stock

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AZTECH Wire

Italy . 421 parts In-Stock

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$19.544

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Ampacity Inc.

Singapore . 1,645 parts In-Stock

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$21.500

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Semicontronic

India . 706 parts In-Stock

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$24.500

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$23.888

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$23.765

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706

$24.500

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One Stop Electronics

USA . 1,118 parts In-Stock

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$38.500

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Corphita

USA . 4,339 parts In-Stock

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Argo Parts USA

USA . 3,386 parts In-Stock

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Continental Prestige Electronics

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Vigor

Singapore . 903 parts In-Stock

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UNI Independent Distributors

Spain . 381 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unlock a world of possibilities with the NTS0104UK-Q100Z by NXP Semiconductors. This high-quality interface IC offers unparalleled reliability and versatility, making it ideal for a wide range of applications. Designed with automotive grade components, this product ensures optimal performance even in extreme conditions. Experience seamless connectivity and enhanced functionality with the NTS0104UK-Q100Z, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for automotive applications.

Surface Mount: YES

Being surface mountable makes it easier to integrate this IC into PCB designs, saving space and reducing assembly time.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high reliability and quality standards, making it suitable for automotive electronics.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB and easy alignment during assembly.

Power Supplies (V): 1.8/3.3, 2.5/5

The versatility in power supply options allows for compatibility with a wide range of systems and voltage requirements.

No. of Terminals: 12

With 12 terminals, this IC offers a sufficient number of connections for interfacing with other components.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style provide a high level of connectivity and precision for optimal performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability even in harsh automotive environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in a wide range of temperature conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection to the PCB.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that this IC is designed to withstand the temperature variations commonly encountered in automotive applications.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection, ideal for automotive environments where vibration and shock may occur.

Terminal Pitch: 0.4 mm

The small terminal pitch allows for high-density mounting and efficient use of PCB space.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit type IC, this product is designed to facilitate communication between different parts of a system, making it a versatile choice for various applications.

Technical Specifications

Other Function Interface ICs NTS0104UK-Q100Z attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PBGA-B12

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA12,3X4,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.8/3.3,2.5/5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Other Interface ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Trade Compliance

NTS0104UK-Q100Z Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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