Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NTS0103GU10,115 by NXP Semiconductors is a versatile interface IC designed for automotive applications. It operates within a voltage range of 1.8/3.3V to 2.5/5V and withstands temperatures from -40 °C to 125 °C. Its compact chip carrier design features 10 terminals with a 0.4mm pitch for efficient surface mounting.
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The use of plastic/epoxy not only provides durability against environmental factors but also keeps the product lightweight, making it suitable for various applications.
Being surface mount allows for a compact design, facilitating space-saving in the overall circuit layout, enhancing design flexibility.
The rectangular package shape optimizes space efficiency on PCBs, making it easier to fit into tight layouts while ensuring reliable connections.
The wide range of supported power supplies makes this IC versatile and compatible with various electronic systems, accommodating different voltage requirements.
With 10 terminals, this IC offers ample connectivity options, ensuring it can be integrated effectively into a range of applications without sacrificing functionality.
As a chip carrier, this package style simplifies integration onto PCBs, promoting efficient thermal management and enhancing overall performance.
The high maximum operating temperature signifies robust thermal performance, making this IC suitable for demanding automotive applications.
A minimum operating temperature of -40 °C ensures reliability in extreme conditions, making the product ideal for automotive and outdoor applications.
The quad terminal position layout facilitates efficient wiring and enhances signal integrity, essential for high-speed applications.
A maximum of 30 seconds at peak reflow temperature allows for effective soldering without compromising the integrity of the components, ensuring quality manufacturing.
A peak reflow temperature of 260 °C is advantageous for ensuring robust solder joints, essential for high-reliability automotive applications.
Designed with an automotive temperature grade, this product guarantees performance and reliability in automotive environments, ensuring it meets industry standards.
The no-lead terminal form aids in reducing PCB space and enhances solderability, augmenting the ease of assembly and improving overall product reliability.
A terminal pitch of 0.4 mm helps achieve high-density designs, making the IC suitable for modern compact circuit layouts while maintaining connectivity.
Other Function Interface ICs NTS0103GU10,115 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors
JESD-30 Code:
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NTS0103GU10,115 Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult Dev EOL 21/Apr/2020
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
ULN2803A
STMicroelectronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; No. of Elements: 8; Minimum DC Current Gain (hFE): 1000;
2N7002
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
1N4148
Digitron Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM555CMX
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Philips Components
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .2 A; Transistor Application: SWITCHING;
Diotec Semiconductor Ag
M39029/58-360
Conesys
CONNECTOR ACCESSORY; MIL Conformity: YES; Mating Contacts: M39029/57-354; Terminal Type: CRIMP; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT;
LM358M
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
MBRM140T1G
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
2N2222A
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
SS14
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDC5614P
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
Eic Semiconductor
EU2B-YS303C
Idec
ROTARY SWITCH;
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Semitron
RECTIFIER DIODE; Surface Mount: NO; JESD-609 Code: e0; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Maximum Reverse Recovery Time: .004 us;
SI8663BC-B-IS1R
Silicon Labs
SI8663BC-B-IS1R by Silicon Labs is a digital isolator with 16 terminals, operating voltage range of 2.375V to 5.5V, and AEC-Q100 screening for automotive applications. It features CMOS technology, dual terminal position, and small outline package style suitable for high-temperature environments up to 125°C.
ADUM6401ARWZ-RL
Analog Devices
ADUM6401ARWZ-RL by Analog Devices is a digital isolator with 16 terminals, operating b/w -40 to 105°C. It has a supply voltage range of 3V to 5.5V and comes in a small outline package suitable for surface mount applications. Ideal for use in systems requiring high noise immunity and signal isolation.
LTC6820HMS#3ZZPBF
LTC6820HMS#3ZZPBF by Analog Devices is a CMOS interface IC with 16 terminals, operating from -40 to 125 °C. It has a supply voltage range of 2.7V to 5.5V and is AEC-Q100 compliant for automotive applications. The package style is small outline, thin profile, shrink pitch, making it suitable for compact designs in automotive electronics.
PM8533B-F3EI
Microsemi
INTERFACE CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; No. of Functions: 1; Package Style (Meter): SPECIAL SHAPE;
ADM3260ARSZ
ADM3260ARSZ by Analog Devices is a small outline, shrink pitch interface IC with 20 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 3-5.5V. Ideal for industrial applications requiring dual terminal position and matte tin finish.
ADG3304BRUZ-REEL
ADG3304BRUZ-REEL by Analog Devices is a CMOS interface IC with 14 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 1.15V to 5.5V and is suitable for industrial applications requiring small outline, thin profile packages with shrink pitch technology. The device supports surface mount installation and features dual terminal positions with matte tin finish for reliable performance in various electronic systems.
SI8641BA-B-IUR
Skyworks Solutions
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
CLT3-4BT6-TR
CLT3-4BT6-TR by STMicroelectronics is a 4-function interface IC with 20 terminals, operating at 24V. It features a small outline package style and dual terminal position, suitable for applications requiring an interface circuit in the temperature range of -25 to 85°C. The IC has a moisture sensitivity level of 3 and peak reflow temperature of 260°C.
MCP2122T-E/SN
Microchip Technology
MCP2122T-E/SN by Microchip Tech is an 8-terminal IC with a supply voltage range of 1.8-5.5V, ideal for automotive applications. It operates b/w -40 to 125°C, featuring CMOS tech and matte tin finish on gull wing terminals. This small outline package measures 4.9mm x 3.9mm with a height of 1.75mm, suitable for surface mount assembly in various electronic devices.
ISOW7821FDWER
Texas Instruments
ISOW7821FDWER by Texas Instruments is a digital isolator with 2 channels, operating at temperatures from -40 to 125°C. It has a supply voltage range of 3-5.5V and comes in a small outline package suitable for automotive applications. With surface mount capability and Gull Wing terminals, it offers reliable isolation for various interface functions.
SI8660BC-B-IS1
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Screening Level: AEC-Q100;
ADUM3201ARZ-RL7
ADUM3201ARZ-RL7 by Analog Devices is a dual-function interface IC with 8 terminals, operating b/w -40 to 105°C. It has a supply voltage range of 3-5.5V and uses CMOS technology. Ideal for industrial applications requiring small outline packages and surface mount compatibility.
TCA9517DGKRQ1
TCA9517DGKRQ1 by Texas Instruments is an 8-terminal interface IC with a supply voltage range of 0.9V to 5.25V, suitable for automotive applications due to AEC-Q100 screening level. It features a small outline package style, dual terminal position, and gull wing form factor for surface mount assembly in tight spaces. Operating temperature ranges from -40°C to 125°C, making it ideal for harsh environments.
FXMA2102L8X
FXMA2102L8X by Onsemi is a surface mount interface IC with 8 terminals, operating at supply voltages of 1.65V to 5.5V. With a package style of CHIP CARRIER and very thin profile, it is ideal for industrial applications requiring an interface circuit in tight spaces. This IC can withstand temperatures from -40°C to 85°C, making it suitable for various industrial environments.
ISO7041DBQR
The Texas Instruments ISO7041DBQR is a CMOS interface IC with 4 functions, suitable for automotive applications. It operates b/w -40 to 125°C, with a supply voltage range of 1.71V to 5.5V. This small outline package has 16 terminals and nickel palladium gold finish for robust performance in various electronic systems.
ISO7731BDW
ISO7731BDW by Texas Instruments is a 16-terminal interface IC with CMOS technology. It operates in temperatures from -55 to 125°C, suitable for military-grade applications. With a supply voltage range of 2.25-5.5V, it offers 3 channels and features a small outline package style for surface mount assembly.
PCA9517ADMR2G
PCA9517ADMR2G by Onsemi is an 8-terminal IC with a supply voltage range of 0.9V to 5.5V, suitable for industrial applications. It features a small outline package style and operates in temperatures from -40°C to 85°C. This interface circuit supports surface mount installation and has a terminal pitch of 0.65mm.
MAX3869EHJ+
Maxim Integrated
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: HTFQFP; Package Shape: SQUARE;
ISO7760FDWR
ISO7760FDWR by Texas Instruments is a CMOS interface IC with 6 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 2.25-5.5 V and comes in a small outline package suitable for military-grade applications. The device features dual terminals with nickel/palladium/gold finish, making it ideal for various function interface requirements.
SI8642BB-B-IS1
SI8642BB-B-IS1 by Silicon Labs is a digital isolator with 4 functions, operating voltage range of 2.375V to 5.5V, and temperature range from -40°C to 125°C. It comes in a small outline package suitable for surface mount applications, making it ideal for use in various electronic devices requiring signal isolation.
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NTS0102DP-Q100H
NXP Semiconductors
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR;
NTS0102GD-Q100H
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: SON; Package Shape: RECTANGULAR;
NTS0308EPWJ
INTERFACE CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1;
NTS0104UK-Q100Z
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 12; Package Code: FBGA; Package Shape: RECTANGULAR;
NTS0302JKZ
INTERFACE CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Maximum Seated Height: .33 mm;
NTS0102DP-Q100
INTERFACE CIRCUIT; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Screening Level: AEC-Q100; Moisture Sensitivity Level (MSL): 1;
NTS0102GD-Q100
INTERFACE CIRCUIT; JESD-609 Code: e4; Screening Level: AEC-Q100; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1;
NTS0103GU10
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: VQCCN; Package Shape: RECTANGULAR;
NTS0104D,118
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
NTS0308EPW
INTERFACE CIRCUIT;
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