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NTS0103GU10,115

NXP Semiconductors

NTS0103GU10,115 by NXP Semiconductors

NTS0103GU10,115 by NXP Semiconductors is a versatile interface IC designed for automotive applications. It operates within a voltage range of 1.8/3.3V to 2.5/5V and withstands temperatures from -40 °C to 125 °C. Its compact chip carrier design features 10 terminals with a 0.4mm pitch for efficient surface mounting.

Median Price

$0.732

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,796 parts In-Stock

1+ parts

$0.870

100+ parts

$0.494

1k+ parts

$0.425

10k+ parts

-

1,796

$0.870

$0.494

$0.425

-

Rochester

USA . 6,604 parts In-Stock

1+ parts

-

100+ parts

$0.706

1k+ parts

$0.586

10k+ parts

$0.522

6,604

-

$0.706

$0.586

$0.522

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.732

10k+ parts

$0.653

4,000

-

-

$0.732

$0.653

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,189 parts In-Stock

1+ parts

$0.550

100+ parts

-

1k+ parts

-

10k+ parts

-

1,189

$0.550

-

-

-

Vyrian

USA . 2,223 parts In-Stock

1+ parts

$0.579

100+ parts

-

1k+ parts

-

10k+ parts

-

2,223

$0.579

-

-

-

Anansix

USA . 317 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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317

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,865 parts In-Stock

1+ parts

$0.521

100+ parts

-

1k+ parts

-

10k+ parts

-

4,865

$0.521

-

-

-

Component Stockers USA

USA . 8,728 parts In-Stock

1+ parts

$0.600

100+ parts

$0.560

1k+ parts

$0.410

10k+ parts

-

8,728

$0.600

$0.560

$0.410

-

Microchip USA

USA . 384 parts In-Stock

1+ parts

$1.580

100+ parts

-

1k+ parts

-

10k+ parts

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384

$1.580

-

-

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UNI Independent Distributors

Spain . 7,734 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,734

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,000

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Overview

Unlock unparalleled performance with the NTS0103GU10,115 from NXP Semiconductors! Renowned for their commitment to quality and innovation, NXP delivers this exceptional interface IC designed to enhance your automotive applications. Offering reliability in extreme temperature conditions and a compact surface mount design, it ensures seamless connectivity and efficiency. Elevate your projects with proven technology that drives success and maximizes value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy not only provides durability against environmental factors but also keeps the product lightweight, making it suitable for various applications.

Surface Mount: YES

Being surface mount allows for a compact design, facilitating space-saving in the overall circuit layout, enhancing design flexibility.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space efficiency on PCBs, making it easier to fit into tight layouts while ensuring reliable connections.

Power Supplies (V): 1.8/3.3, 2.5/5

The wide range of supported power supplies makes this IC versatile and compatible with various electronic systems, accommodating different voltage requirements.

No. of Terminals: 10

With 10 terminals, this IC offers ample connectivity options, ensuring it can be integrated effectively into a range of applications without sacrificing functionality.

Package Style (Meter): CHIP CARRIER

As a chip carrier, this package style simplifies integration onto PCBs, promoting efficient thermal management and enhancing overall performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature signifies robust thermal performance, making this IC suitable for demanding automotive applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliability in extreme conditions, making the product ideal for automotive and outdoor applications.

Terminal Position: QUAD

The quad terminal position layout facilitates efficient wiring and enhances signal integrity, essential for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum of 30 seconds at peak reflow temperature allows for effective soldering without compromising the integrity of the components, ensuring quality manufacturing.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C is advantageous for ensuring robust solder joints, essential for high-reliability automotive applications.

Temperature Grade: AUTOMOTIVE

Designed with an automotive temperature grade, this product guarantees performance and reliability in automotive environments, ensuring it meets industry standards.

Terminal Form: NO LEAD

The no-lead terminal form aids in reducing PCB space and enhances solderability, augmenting the ease of assembly and improving overall product reliability.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm helps achieve high-density designs, making the IC suitable for modern compact circuit layouts while maintaining connectivity.

Technical Specifications

Other Function Interface ICs NTS0103GU10,115 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PQCC-N10

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC10,.06X.07,16

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3,2.5/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NTS0103GU10,115 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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