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NTS0103GU10

NXP Semiconductors

NTS0103GU10 by NXP Semiconductors

NTS0103GU10 by NXP Semiconductors is a versatile interface IC designed for automotive applications. It operates within a supply voltage range of 1.65-3.6 V and withstands temperatures from -40 °C to 125 °C. Its compact, no-lead design features a very thin profile with 10 terminals for efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,234 parts In-Stock

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Vyrian

USA . 3,803 parts In-Stock

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Anansix

USA . 1,934 parts In-Stock

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One Stop Electronics

USA . 1,381 parts In-Stock

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$36.500

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UNI Independent Distributors

Spain . 3,173 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 2,136 parts In-Stock

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Kepictronics

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Perfect Parts

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Overview

Unlock unparalleled performance with the NTS0103GU10 from NXP Semiconductors, a leader in innovative technology. This high-quality interface IC is designed for reliability in automotive applications, operating seamlessly between -40 °C and 125 °C. Its compact, thin profile enables efficient space utilization, while its versatile power supply options enhance design flexibility. Experience superior quality and innovation that drive your projects forward, ensuring you achieve outstanding results with every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material ensures good protection and performance in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier assembly, making it ideal for space-constrained applications.

Maximum Supply Voltage: 3.6 V

This wide voltage range provides versatility for various electronic designs and power supply configurations.

Package Shape: RECTANGULAR

The rectangular shape enhances layout flexibility and optimization in circuit board designs.

Power Supplies (V): 1.8/3.3, 2.5/5

Support for multiple supply voltages allows this interface IC to be easily integrated into a variety of systems.

No. of Terminals: 10

With 10 terminals, this IC provides sufficient connectivity options for interfacing with other components effectively.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The thin profile design is ideal for modern electronics that prioritize space efficiency.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage expands compatibility with low-power applications, promoting energy efficiency.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability and performance in demanding environments, suitable for automotive applications.

Minimum Operating Temperature: -40 °C

This wide temperature range makes the IC suitable for use in extreme conditions, enhancing its versatility.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and enhances connectivity, allowing for efficient designs.

Maximum Seated Height: 0.5 mm

The low seated height contributes to a slim assembly profile, making it ideal for compact device designs.

Width: 1.4 mm

The narrow width enables high-density PCB layouts, maximizing component placement efficiency.

Maximum Time At Peak Reflow Temperature: 30 s

A longer peak reflow time allows for better soldering efficacy, ensuring strong connections during assembly.

Peak Reflow Temperature: 260 °C

This high reflow temperature supports lead-free soldering processes, aligning with modern industry standards.

Length: 1.8 mm

The compact length supports high integration and dense assembly, making it suitable for miniaturized applications.

Temperature Grade: AUTOMOTIVE

Grade for automotive applications indicates robustness and reliability in automotive electronic systems.

Terminal Form: NO LEAD

No lead design enhances thermal performance and minimizes parasitic inductance, making it more efficient in operation.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V optimizes power consumption, making it suitable for battery-operated devices.

Terminal Pitch: 0.4 mm

A fine pitch allows for high-density connections on compact circuit boards, meeting the needs of modern electronic designs.

Interface IC Type: INTERFACE CIRCUIT

Designed as an interface IC, it efficiently handles communication between different system components, enhancing overall system performance.

Technical Specifications

Other Function Interface ICs NTS0103GU10 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Additional Features:

IT ALSO REQUIRES 2.3 TO 5.5 V

Interface IC Type:

JESD-30 Code:

R-PQCC-N10

Length:

1.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC10,.06X.07,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3,2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.4 mm

Trade Compliance

NTS0103GU10 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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