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PCA9306DCUTG4

Texas Instruments

PCA9306DCUTG4 by Texas Instruments

PCA9306DCUTG4 by Texas Instruments is an 8-terminal IC with dual functions, operating b/w -40 to 85°C. It has a supply voltage range of 1.2V to 5.5V and is ideal for industrial applications requiring interface circuitry in compact spaces due to its small outline package style.

Median Price

$0.611

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 30,610 parts In-Stock

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$0.611

10k+ parts

$0.526

30,610

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$0.611

$0.526

Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

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$0.629

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$0.629

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Chip Stock

USA . 121,530 parts In-Stock

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Vyrian

USA . 30,389 parts In-Stock

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Digiode

USA . 2,337 parts In-Stock

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EZ Electronic Parts

Israel . 250 parts In-Stock

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Greenchips

USA . 86 parts In-Stock

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SIE Connect GmbH - GreenChips

Germany . 86 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 30,212 parts In-Stock

1+ parts

$0.520

100+ parts

$0.507

1k+ parts

$0.504

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30,212

$0.520

$0.507

$0.504

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Ampacity Inc.

Singapore . 30,175 parts In-Stock

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$0.520

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$0.520

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Continental Prestige Electronics

USA . 1,237 parts In-Stock

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$0.629

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$0.616

1,237

$0.629

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Argo Parts USA

USA . 551 parts In-Stock

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$0.629

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$0.610

551

$0.629

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$0.610

Advanced Electronics

New Zealand . 74 parts In-Stock

1+ parts

$7.367

100+ parts

$6.998

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$6.998

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74

$7.367

$6.998

$6.998

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Corohmni

South Africa . 286 parts In-Stock

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$7.934

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Parana Technologies

USA . 2,250 parts In-Stock

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$11.883

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$12.279

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$11.883

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ChromeModa Solutions

Germany . 4,539 parts In-Stock

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$13.352

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$10.949

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IDEA Electronic Components Group

UK . 181 parts In-Stock

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$13.352

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$12.684

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$12.017

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$12.017

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GreenTree Electronics

Israel . 126,289 parts In-Stock

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Lixinc

USA . 4,017 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 2,688 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,369 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$0.616

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$0.598

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$0.585

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Kepictronics

USA . 1,988 parts In-Stock

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Formix International (Excess)

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DigiPath Technology Company

USA . 683 parts In-Stock

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Perfect Parts

USA . 472 parts In-Stock

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Robosynatics

Brazil . 300 parts In-Stock

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Lucentia Tech

USA . 300 parts In-Stock

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$0.851

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Microchip USA

USA . 259 parts In-Stock

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Overview

Unlock seamless connectivity with the PCA9306DCUTG4 by Texas Instruments. Designed with precision and quality in mind, this interface IC offers unparalleled performance and reliability. Whether you're looking to enhance your industrial applications or streamline your electronic devices, this product delivers exceptional value and benefits. Trust in Texas Instruments' expertise and elevate your projects with the PCA9306DCUTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the components inside the package, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 3.3 V

Supports a maximum supply voltage of 3.3V, compatible with a wide range of electronic devices and systems.

No. of Functions: 2

Offers two different functions in a single IC, providing versatility and efficiency in circuit design.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into various circuit board layouts, optimizing space utilization.

Maximum Supply Voltage-1: 5.5 V

Can handle a maximum supply voltage of 5.5V, making it suitable for applications with higher voltage requirements.

No. of Terminals: 8

With 8 terminals, this IC offers multiple connection points for enhanced functionality and integration within a circuit.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

The small outline and thin profile of the package design save space on the circuit board, making it ideal for compact electronic devices.

Minimum Supply Voltage-1: 1.8 V

Can operate at a minimum supply voltage of 1.8V, ensuring compatibility with lower voltage systems while maintaining performance.

Minimum Supply Voltage: 1.2 V

Supports a minimum supply voltage of 1.2V, enabling energy-efficient operation in low-power applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand high-temperature environments and maintain reliable performance.

Minimum Operating Temperature: -40 °C

Capable of operating at temperatures as low as -40°C, suitable for use in a wide range of environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit board layout and connection options, accommodating different design requirements.

Maximum Seated Height: 0.9 mm

Low maximum seated height allows for slim and compact device designs, saving space and improving overall aesthetics.

Width: 2 mm

Compact width dimension makes this IC suitable for applications with space constraints, enabling versatile design possibilities.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering and assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

Can withstand peak reflow temperatures of 260°C, meeting industry standards for soldering and assembly processes.

Length: 2.3 mm

Small length dimension allows for flexible placement and integration within electronic devices, optimizing space utilization.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh operating conditions and environments.

Terminal Form: GULL WING

Gull wing terminal form provides secure mounting and easy soldering onto the circuit board, ensuring stable connections during operation.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5mm enables high-density mounting and efficient use of space on the circuit board.

Interface IC Type: INTERFACE CIRCUIT

Designed as an interface circuit IC, this product facilitates communication and data exchange between different parts of an electronic system.

Technical Specifications

Other Function Interface ICs PCA9306DCUTG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.3 V

Minimum Supply Voltage:

1.2 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

PCA9306DCUTG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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