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ST1G3234BBJR

STMicroelectronics

ST1G3234BBJR by STMicroelectronics

ST1G3234BBJR by STMicroelectronics is a CMOS interface IC designed for industrial applications. It operates b/w 1.4V and 3.6V, with a max temp of 85 °C and features a very thin profile (0.714mm height). Ideal for compact electronic designs requiring reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,557 parts In-Stock

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4,557

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Vyrian

USA . 4,497 parts In-Stock

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4,497

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Anansix

USA . 2,299 parts In-Stock

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2,299

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,413 parts In-Stock

1+ parts

$5.237

100+ parts

-

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$4.713

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1,413

$5.237

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$4.713

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MKK Technologies

India . 947 parts In-Stock

1+ parts

$9.847

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947

$9.847

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DigiPath Technology Company

USA . 947 parts In-Stock

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$9.847

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947

$9.847

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AZTECH Wire

Italy . 1,184 parts In-Stock

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$15.860

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1,184

$15.860

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Kepictronics

USA . 20,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,229 parts In-Stock

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Assy Fe

Spain . 5,000 parts In-Stock

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5,000

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Vigor

Singapore . 4,137 parts In-Stock

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Microchip USA

USA . 3,970 parts In-Stock

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3,970

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Corphita

USA . 2,330 parts In-Stock

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2,330

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Parana Technologies

USA . 1,349 parts In-Stock

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$6.261

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1,349

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$6.261

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Elevate your designs with the ST1G3234BBJR from STMicroelectronics, a leader in cutting-edge technology. This high-performance interface IC delivers exceptional reliability across diverse applications, from industrial automation to consumer electronics. With its compact footprint and robust temperature range, you can achieve optimal efficiency without compromising on quality. Trust in STMicroelectronics for innovative solutions that empower your projects and drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and reliability, making the IC suitable for various applications.

Surface Mount: YES

Surface mount technology facilitates easier and more efficient assembly on printed circuit boards, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V enables compatibility with a wide range of low-power applications.

Package Shape: RECTANGULAR

The rectangular shape allows efficient use of PCB layout space, contributing to compact designs.

Power Supplies (V): 1.5/3.3

Supports multiple supply voltages, offering flexibility for design engineers in different power scenarios.

No. of Terminals: 5

Having 5 terminals enables effective connectivity while maintaining a compact design footprint.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style provides excellent heat dissipation and minimizes signal integrity issues in high-frequency applications.

Minimum Supply Voltage: 1.4 V

A low minimum supply voltage allows the IC to operate in energy-sensitive applications, maximizing battery life.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a wide temperature range, this IC can function in extreme conditions, ensuring consistent performance.

Terminal Position: BOTTOM

Bottom terminal positioning promotes better electrical connectivity and optimizes circuit board layout.

Maximum Seated Height: 0.714 mm

A low seated height contributes to compact design and compatibility with dense PCB layouts.

Width: 1.02 mm

The narrow width allows for more efficient use of space on the PCB, permitting higher packing density.

Length: 1.36 mm

Short length ensures that the IC fits easily into smaller devices and contributes to compact overall designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring durability and reliability in harsh working conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, which are essential for modern electronic devices.

Terminal Form: BALL

Ball terminals improve solder joint reliability and help facilitate surface mount assembly.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V strikes a balance between power efficiency and performance, making it suitable for a variety of applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch design enables more terminals to fit in a smaller area, enhancing device functionality without increasing size.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit, it simplifies communication between different components in complex systems.

Technical Specifications

Other Function Interface ICs ST1G3234BBJR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

R-PBGA-B5

Length:

1.36 mm

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA5,3X3,17/10

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

1.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.714 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

1.02 mm

Trade Compliance

ST1G3234BBJR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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