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ST1G3236DTR

STMicroelectronics

ST1G3236DTR by STMicroelectronics

ST1G3236DTR by STMicroelectronics is a compact interface IC designed for industrial applications, operating b/w 1.2V and 3.6V. It features a very thin profile with a max height of 0.55mm and supports temperatures from -40 °C to 85°C. This dual-terminal device is ideal for space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 15,429 parts In-Stock

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Vyrian

USA . 4,255 parts In-Stock

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4,255

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Anansix

USA . 2,230 parts In-Stock

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Digiode

USA . 968 parts In-Stock

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968

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Microchip USA

USA . 444 parts In-Stock

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$2.100

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444

$2.100

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IDEA Electronic Components Group

UK . 1,259 parts In-Stock

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$8.986

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$8.087

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$8.986

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$8.087

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AZTECH Wire

Italy . 431 parts In-Stock

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$9.860

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431

$9.860

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MKK Technologies

India . 430 parts In-Stock

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$16.897

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430

$16.897

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DigiPath Technology Company

USA . 430 parts In-Stock

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$16.897

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430

$16.897

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Assy Fe

Spain . 10,000 parts In-Stock

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Perfect Parts

USA . 8,264 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,252 parts In-Stock

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Kepictronics

USA . 3,461 parts In-Stock

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Parana Technologies

USA . 1,282 parts In-Stock

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$10.744

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Corphita

USA . 1,120 parts In-Stock

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Overview

Discover the ST1G3236DTR from STMicroelectronics—an exceptional interface IC designed for reliability and efficiency in diverse applications. With industrial-grade performance, this ultra-thin, surface-mount solution operates seamlessly between -40 °C to 85°C, ensuring resilience in demanding environments. STMicroelectronics stands out for its commitment to quality and innovation, providing you with a trusted partner that transforms your designs into high-performance solutions. Elevate your projects with unmatched versatility and dependability!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier integration into compact circuits and enhances the reliability of connections.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of electronic devices while providing adequate headroom for operation.

Package Shape: RECTANGULAR

The rectangular package shape offers efficient space utilization on PCBs, making it ideal for space-constrained applications.

No. of Terminals: 6

Having 6 terminals allows for sufficient connections needed for complex interfacing while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and very thin profile facilitate high-density layouts in modern electronic applications.

Minimum Supply Voltage: 1.2 V

Operating at a minimum supply voltage of 1.2 V is beneficial for low-power applications, thereby extending battery life.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for use in extreme conditions, ensuring versatility.

Terminal Position: DUAL

The dual terminal position enhances the ease of soldering and improves layout flexibility on the PCB.

Maximum Seated Height: 0.55 mm

A maximum seated height of 0.55 mm aids in maintaining a low profile, essential for slim electronic designs.

Width: 1 mm

At just 1 mm wide, this product can fit into tight spaces, which is crucial for miniaturized electronic applications.

Length: 1.2 mm

A length of 1.2 mm keeps the footprint small, allowing for dense layouts on PCBs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures the product can withstand harsher conditions, making it ideal for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product optimal for various applications.

Terminal Form: NO LEAD

No-lead terminals provide a reliable connection while minimizing space taken on the PCB, contributing to compact designs.

Nominal Supply Voltage: 2.7 V

With a nominal supply voltage of 2.7 V, this IC strikes a balance between power efficiency and performance.

Terminal Pitch: 0.4 mm

The 0.4 mm terminal pitch enables tighter pin configuration, allowing for sophisticated layouts in dense applications.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit IC makes this product versatile for a wide range of interfacing tasks in various electronics.

Technical Specifications

Other Function Interface ICs ST1G3236DTR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

R-XDSO-N6

Length:

1.2 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1 mm

Trade Compliance

ST1G3236DTR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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