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ST4G3234BJR

STMicroelectronics

ST4G3234BJR by STMicroelectronics

ST4G3234BJR by STMicroelectronics is a CMOS interface IC designed for industrial applications. It operates b/w 1.4V and 3.6V, with a max temp of 85 °C and features an ultra-thin profile in a 11-terminal grid array package. Ideal for space-constrained designs.

Median Price

$1.920

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 10 parts In-Stock

1+ parts

$1.920

100+ parts

$1.440

1k+ parts

$1.250

10k+ parts

-

10

$1.920

$1.440

$1.250

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Vyrian

USA . 4,744 parts In-Stock

1+ parts

-

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4,744

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ECAB

Sweden . 2,550 parts In-Stock

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2,550

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Digiode

USA . 1,978 parts In-Stock

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1,978

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Anansix

USA . 959 parts In-Stock

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959

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Corel Iberica Componentes, S.L.

Spain . 390 parts In-Stock

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390

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,660 parts In-Stock

1+ parts

$7.886

100+ parts

-

1k+ parts

$7.098

10k+ parts

-

1,660

$7.886

-

$7.098

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MKK Technologies

India . 1,159 parts In-Stock

1+ parts

$14.830

100+ parts

-

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1,159

$14.830

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DigiPath Technology Company

USA . 1,159 parts In-Stock

1+ parts

$14.830

100+ parts

-

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1,159

$14.830

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AZTECH Wire

Italy . 372 parts In-Stock

1+ parts

$17.390

100+ parts

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372

$17.390

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Kepictronics

USA . 39,000 parts In-Stock

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39,000

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Metaverse IC Inc.

Canada . 33,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,877 parts In-Stock

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5,877

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Authorized Procurement Solutions

USA . 4,550 parts In-Stock

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4,550

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Microchip USA

USA . 4,083 parts In-Stock

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4,083

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Parana Technologies

USA . 2,037 parts In-Stock

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$9.429

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2,037

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$9.429

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A-Z Elektronik GmbH

Germany . 1,833 parts In-Stock

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1,833

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Assy Fe

Spain . 1,390 parts In-Stock

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1,390

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Vigor

Singapore . 1,312 parts In-Stock

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1,312

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Corphita

USA . 1,253 parts In-Stock

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1,253

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Overview

Unlock unparalleled performance with the ST4G3234BJR from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality interface IC is designed for reliability across diverse applications, from industrial controls to consumer electronics. With its robust temperature range and compact design, it ensures seamless integration and exceptional efficiency. Elevate your projects with a product that embodies quality, precision, and the trusted expertise of STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable materials ensure longevity and reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier PCB assembly.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular packages facilitate efficient space utilization on printed circuit boards.

Power Supplies (V): 1.5/3.3

Compatible with that wide range of power supply voltages, enhancing versatility.

No. of Terminals: 11

Multiple terminals allow for complex interfacing options in electronic designs.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Thin profile and fine pitch design allow for high-density mounting and reduced board space.

Minimum Supply Voltage: 1.4 V

Low minimum supply voltage makes this IC suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

Able to operate in high-temperature environments, ideal for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliability in extreme conditions.

Terminal Position: BOTTOM

Bottom terminals facilitate easier integration into PCB layouts.

Maximum Seated Height: 0.715 mm

Compact height allows for slimmer product designs and improved space management.

Width: 1.41 mm

Narrow width is advantageous for high-density applications.

Length: 2.04 mm

Compact length supports compact product designs, fitting easily in small devices.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, ensuring durability in challenging environments.

Technology: CMOS

CMOS technology offers low power consumption and high performance.

Terminal Form: BALL

Ball terminals enhance thermal and electrical performance, providing better connectivity.

Nominal Supply Voltage: 1.65 V

Optimized nominal supply voltage allows for efficient operation in low-power applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch supports more connections in a smaller area, beneficial in compact designs.

Interface IC Type: INTERFACE CIRCUIT

Specialized as an interface circuit, it enhances communication between different components.

Technical Specifications

Other Function Interface ICs ST4G3234BJR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

R-PBGA-B11

Length:

2.04 mm

No. of Functions:

1

No. of Terminals:

11

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA11,3X7,17/10

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.715 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.65 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.41 mm

Trade Compliance

ST4G3234BJR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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