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HPA02270YZPR

Texas Instruments

HPA02270YZPR by Texas Instruments

The Texas Instruments HPA02270YZPR is an 8-terminal interface IC with a supply voltage range of 1.65V to 3.6V, suitable for industrial applications. Featuring a rectangular package style with very thin profile and fine pitch grid array, it operates b/w -40°C to 85°C. With terminal finish in tin silver copper and ball form, this IC has a compact size of 1.888mm x 0.888mm and peak reflow temperature of 260°C for quick assembly processes.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,015 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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9,015

-

-

-

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Digiode

USA . 2,264 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,264

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,106 parts In-Stock

1+ parts

$12.583

100+ parts

-

1k+ parts

$13.035

10k+ parts

-

2,106

$12.583

-

$13.035

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AZTECH Wire

Italy . 835 parts In-Stock

1+ parts

$13.157

100+ parts

-

1k+ parts

-

10k+ parts

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835

$13.157

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-

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DigiPath Technology Company

USA . 2,296 parts In-Stock

1+ parts

$13.855

100+ parts

$12.747

1k+ parts

-

10k+ parts

-

2,296

$13.855

$12.747

-

-

ChromeModa Solutions

Germany . 3,109 parts In-Stock

1+ parts

$14.138

100+ parts

$11.593

1k+ parts

-

10k+ parts

-

3,109

$14.138

$11.593

-

-

IDEA Electronic Components Group

UK . 1,557 parts In-Stock

1+ parts

$14.138

100+ parts

$13.431

1k+ parts

$12.724

10k+ parts

-

1,557

$14.138

$13.431

$12.724

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One Stop Electronics

USA . 185 parts In-Stock

1+ parts

$19.500

100+ parts

-

1k+ parts

-

10k+ parts

-

185

$19.500

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-

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Corphita

USA . 4,483 parts In-Stock

1+ parts

-

100+ parts

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4,483

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Microchip USA

USA . 2,448 parts In-Stock

1+ parts

-

100+ parts

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2,448

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Overview

Discover the cutting-edge technology of the HPA02270YZPR by Texas Instruments, a top-tier manufacturer known for its superior quality and reliability. This Interface IC boasts a wide range of applications in various industries, offering customers unparalleled value and benefits. With a sleek rectangular design and a maximum supply voltage of 3.6V, this product provides optimal performance even in challenging environments. Trust in Texas Instruments to deliver innovative solutions that exceed your expectations. Elevate your projects with the HPA02270YZPR today!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation onto PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs, making it versatile for different applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB, optimizing layout design.

Minimum Operating Temperature: -40 °C

Capable of operating in very low temperature environments, suitable for industrial and harsh conditions.

Terminal Finish: TIN SILVER COPPER

Provides reliable electrical connections and resistance to corrosion, ensuring long-term performance.

Width: 0.888 mm

Compact width allows for high density integration on the PCB, saving space and enabling efficient design.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes thermal stress on components during assembly, ensuring product reliability.

Nominal Supply Voltage: 1.8 V

Optimal voltage supply for efficient and stable operation of the interface IC.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuit applications, ensuring compatibility and performance.

Technical Specifications

Other Function Interface ICs HPA02270YZPR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCCB = 2.3V TO 5.5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-XBGA-B8

JESD-609 Code:

e1

Length:

1.888 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

.888 mm

Trade Compliance

HPA02270YZPR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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