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HPA02222DR

Texas Instruments

HPA02222DR by Texas Instruments

The Texas Instruments HPA02222DR is an 8-terminal interface IC with a supply voltage range of 3V to 5.5V, suitable for automotive applications. It features a small outline package style, dual terminal position, and nickel palladium gold finish. With an operating temperature range from -40°C to 125°C, it is ideal for various function interface requirements in automotive electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,988 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,988

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-

-

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Digiode

USA . 3,841 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,841

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 835 parts In-Stock

1+ parts

$3.008

100+ parts

-

1k+ parts

$3.515

10k+ parts

-

835

$3.008

-

$3.515

-

DigiPath Technology Company

USA . 1,042 parts In-Stock

1+ parts

$3.312

100+ parts

$3.047

1k+ parts

-

10k+ parts

-

1,042

$3.312

$3.047

-

-

ChromeModa Solutions

Germany . 3,271 parts In-Stock

1+ parts

$3.380

100+ parts

$2.772

1k+ parts

-

10k+ parts

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3,271

$3.380

$2.772

-

-

IDEA Electronic Components Group

UK . 1,162 parts In-Stock

1+ parts

$3.380

100+ parts

-

1k+ parts

$3.042

10k+ parts

-

1,162

$3.380

-

$3.042

-

AZTECH Wire

Italy . 808 parts In-Stock

1+ parts

$9.032

100+ parts

-

1k+ parts

-

10k+ parts

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808

$9.032

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-

-

One Stop Electronics

USA . 1,286 parts In-Stock

1+ parts

$37.500

100+ parts

-

1k+ parts

-

10k+ parts

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1,286

$37.500

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-

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Corphita

USA . 429 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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429

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Overview

Elevate your projects with the HPA02222DR by Texas Instruments, a top-tier manufacturer known for delivering quality and reliability. This interface IC is perfect for a wide range of applications, offering seamless integration and high performance. With a compact design and a wide operating temperature range, this product provides exceptional value and efficiency to customers. Trust in Texas Instruments to provide innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy and reliable mounting onto PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 5.5 V

Can handle a wide range of supply voltages, making it versatile for different power requirements.

Package Shape: RECTANGULAR

Helps in efficient placement and orientation on the PCB, optimizing space utilization.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for challenging environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold conditions, ensuring reliability in various climate conditions.

Nominal Supply Voltage: 3.3 V

Standard supply voltage that is commonly used in many electronic devices, ensuring compatibility.

Terminal Pitch: 1.27 mm

The small pitch allows for high-density mounting on the PCB, allowing for more functionality in a compact space.

Technical Specifications

Other Function Interface ICs HPA02222DR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

HPA02222DR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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