Loading...

HPA02225DR

Texas Instruments

HPA02225DR by Texas Instruments

The Texas Instruments HPA02225DR is an interface IC with 8 terminals, operating voltage range of 0.9V to 5.5V, and industrial temperature grade. It features a BICMOS technology, GULL WING terminal form, and small outline package style. Ideal for applications requiring reliable interface circuitry in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,919 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,919

-

-

-

-

Digiode

USA . 1,214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,214

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,937 parts In-Stock

1+ parts

$9.058

100+ parts

-

1k+ parts

$9.719

10k+ parts

-

1,937

$9.058

-

$9.719

-

ChromeModa Solutions

Germany . 1,892 parts In-Stock

1+ parts

$10.177

100+ parts

$8.345

1k+ parts

-

10k+ parts

-

1,892

$10.177

$8.345

-

-

IDEA Electronic Components Group

UK . 1,389 parts In-Stock

1+ parts

$10.177

100+ parts

$9.668

1k+ parts

$9.159

10k+ parts

-

1,389

$10.177

$9.668

$9.159

-

AZTECH Wire

Italy . 716 parts In-Stock

1+ parts

$12.042

100+ parts

-

1k+ parts

-

10k+ parts

-

716

$12.042

-

-

-

One Stop Electronics

USA . 224 parts In-Stock

1+ parts

$43.500

100+ parts

-

1k+ parts

-

10k+ parts

-

224

$43.500

-

-

-

DigiPath Technology Company

USA . 1,166 parts In-Stock

1+ parts

-

100+ parts

$9.176

1k+ parts

-

10k+ parts

-

1,166

-

$9.176

-

-

Corphita

USA . 583 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

583

-

-

-

-

Overview

Unleash the power of seamless connectivity with the HPA02225DR by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. The HPA02225DR falls under the category of Other Function Interface ICs, offering unparalleled performance and versatility. From its compact design to its wide operating temperature range, this interface circuit is perfect for various applications. Experience the value and benefits of this innovative product, designed to elevate your projects to new heights. Choose Texas Instruments for superior technology solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the internal components of the IC.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Support for a high maximum supply voltage enables compatibility with a wide range of power sources.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement and alignment on circuit boards.

Power Supplies (V): 3/5

Support for multiple power supply voltages gives flexibility in system design and integration.

No. of Terminals: 8

Sufficient number of terminals for connecting to other components and circuitry in the system.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in saving space on the PCB and allows for compact designs.

Minimum Supply Voltage: 0.9 V

Low minimum supply voltage requirement enables operation in low-power environments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance makes it suitable for industrial applications where temperature may vary.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature threshold ensures performance in extreme temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position allows for multiple connection options and flexibility in PCB layout.

Maximum Seated Height: 1.75 mm

Low seated height enables slim and compact designs for the overall system.

Width: 3.9 mm

Narrow width contributes to space-saving on the PCB and ease of routing.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature ensures safe soldering process during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures reliable soldering and robust connections.

Length: 4.9 mm

Compact length contributes to efficient placement and spacing on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh environmental conditions.

Technology: BICMOS

BICMOS technology offers a combination of high-speed performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering during assembly.

Nominal Supply Voltage: 2.7 V

Stable nominal supply voltage ensures consistent and reliable operation of the IC.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for compact and high-density mounting on the PCB.

Interface IC Type: INTERFACE CIRCUIT

Interface circuit type enables seamless communication and data exchange between different components in the system.

Technical Specifications

Other Function Interface ICs HPA02225DR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 2.7 TO 5.5 V

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

HPA02225DR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 4