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LM8335TLE/NOPB

Texas Instruments

LM8335TLE/NOPB by Texas Instruments

LM8335TLE/NOPB by Texas Instruments is a 16-terminal IC with a supply voltage range of 1.65V to 3.6V, operating b/w 0°C to 85°C. It features a grid array package style with very thin profile and fine pitch, suitable for interface circuit applications requiring precise signal processing in compact spaces.

Median Price

$2.550

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 20,826 parts In-Stock

1+ parts

$2.195

100+ parts

$1.813

1k+ parts

$0.980

10k+ parts

-

20,826

$2.195

$1.813

$0.980

-

Mouser Electronics

USA . 331 parts In-Stock

1+ parts

$4.980

100+ parts

$3.170

1k+ parts

$2.820

10k+ parts

$2.790

331

$4.980

$3.170

$2.820

$2.790

DigiKey

USA . 914 parts In-Stock

1+ parts

$5.050

100+ parts

$3.211

1k+ parts

-

10k+ parts

-

914

$5.050

$3.211

-

-

Rochester

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$2.280

1k+ parts

$2.040

10k+ parts

$1.920

750

-

$2.280

$2.040

$1.920

Verical

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.550

10k+ parts

$2.400

750

-

-

$2.550

$2.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,780 parts In-Stock

1+ parts

$1.292

100+ parts

-

1k+ parts

-

10k+ parts

-

1,780

$1.292

-

-

-

Vyrian

USA . 5,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,910

-

-

-

-

DigiKey Marketplace

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$1.420

1k+ parts

-

10k+ parts

-

750

-

$1.420

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 177 parts In-Stock

1+ parts

$1.224

100+ parts

-

1k+ parts

-

10k+ parts

-

177

$1.224

-

-

-

Parana Technologies

USA . 1,881 parts In-Stock

1+ parts

$4.655

100+ parts

-

1k+ parts

$5.134

10k+ parts

-

1,881

$4.655

-

$5.134

-

DigiPath Technology Company

USA . 1,833 parts In-Stock

1+ parts

$5.125

100+ parts

-

1k+ parts

-

10k+ parts

-

1,833

$5.125

-

-

-

ChromeModa Solutions

Germany . 6,285 parts In-Stock

1+ parts

$5.230

100+ parts

$4.289

1k+ parts

-

10k+ parts

-

6,285

$5.230

$4.289

-

-

IDEA Electronic Components Group

UK . 2,262 parts In-Stock

1+ parts

$5.230

100+ parts

-

1k+ parts

$4.707

10k+ parts

-

2,262

$5.230

-

$4.707

-

Lixinc

USA . 4,135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,135

-

-

-

-

Overview

Enhance your electronic projects with the LM8335TLE/NOPB by Texas Instruments, a top-quality interface circuit IC that offers unmatched reliability and precision. Designed by the renowned manufacturer Texas Instruments, this product is perfect for a wide range of applications in various industries. With its cutting-edge technology and innovative design, the LM8335TLE/NOPB provides customers with exceptional value, efficiency, and performance. Upgrade your projects today with this versatile and high-quality interface IC!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

Supports a high maximum supply voltage, making it versatile for a wide range of applications.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and simplifies PCB layout.

No. of Terminals: 16

With 16 terminals, this IC can handle multiple functions or interfaces, providing flexibility in design.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a very thin profile and fine pitch allows for high-density mounting and improved electrical performance.

Minimum Supply Voltage: 1.65 V

Supports a low minimum supply voltage, allowing for operation in low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in harsh environments.

Minimum Operating Temperature: 0 °C

Wide range of minimum operating temperature allows for use in both extreme cold and hot conditions.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides excellent solderability and corrosion resistance for a long-lasting connection.

Terminal Position: BOTTOM

Bottom terminal position allows for easy placement and secure connection on the PCB.

Maximum Seated Height: 0.675 mm

Low maximum seated height minimizes the overall height profile of the IC, ideal for slim devices.

Width: 1.96 mm

Compact width size enables space-saving design and efficient use of PCB real estate.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability of 260°C ensures proper solder melting and joint formation.

Length: 1.96 mm

Short length size allows for compact design and efficient use of space on the PCB.

Terminal Form: BALL

Ball terminal form provides reliable and secure connections for stable performance.

Nominal Supply Voltage: 1.8 V

Nominal supply voltage of 1.8V is suitable for a wide range of applications, providing compatibility and flexibility.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and efficient use of space on the PCB.

Interface IC Type: INTERFACE CIRCUIT

Specialized for interface control, making it a reliable choice for applications requiring interface management.

Technical Specifications

Other Function Interface ICs LM8335TLE/NOPB attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B16

JESD-609 Code:

e1

Length:

1.96 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.96 mm

Trade Compliance

LM8335TLE/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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