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LM8335TLE

Texas Instruments

LM8335TLE by Texas Instruments

LM8335TLE by Texas Instruments is a 16-terminal interface IC with a package style of grid array, very thin profile, and fine pitch. It operates b/w -30 to 85 °C with supply voltage range of 1.65V to 1.95V. Ideal for applications requiring precise interface circuitry in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,597

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-

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Digiode

USA . 4,832 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,832

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,369 parts In-Stock

1+ parts

$5.868

100+ parts

-

1k+ parts

$6.652

10k+ parts

-

2,369

$5.868

-

$6.652

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DigiPath Technology Company

USA . 1,032 parts In-Stock

1+ parts

$6.461

100+ parts

$5.944

1k+ parts

-

10k+ parts

-

1,032

$6.461

$5.944

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ChromeModa Solutions

Germany . 1,469 parts In-Stock

1+ parts

$6.593

100+ parts

$5.406

1k+ parts

-

10k+ parts

-

1,469

$6.593

$5.406

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-

IDEA Electronic Components Group

UK . 518 parts In-Stock

1+ parts

$6.593

100+ parts

-

1k+ parts

$5.934

10k+ parts

-

518

$6.593

-

$5.934

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AZTECH Wire

Italy . 198 parts In-Stock

1+ parts

$17.160

100+ parts

-

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10k+ parts

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198

$17.160

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One Stop Electronics

USA . 1,540 parts In-Stock

1+ parts

$28.500

100+ parts

-

1k+ parts

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10k+ parts

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1,540

$28.500

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Corphita

USA . 1,823 parts In-Stock

1+ parts

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1,823

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Overview

Elevate your electronic projects with the LM8335TLE by Texas Instruments - a high-quality interface IC that offers unparalleled performance and reliability. Crafted by the renowned manufacturer, Texas Instruments, this product boasts cutting-edge technology and innovative design. From robotics to consumer electronics, the LM8335TLE is versatile and adaptable to a wide range of applications. Experience seamless integration and enhanced functionality with this top-of-the-line interface circuit. Upgrade your projects today with the LM8335TLE - where quality meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Ease of installation and compatibility with modern PCB assembly processes.

Maximum Supply Voltage: 1.95 V

Allows for flexibility in power supply options without risking damage to the IC.

Package Shape: SQUARE

Compact design that saves space on the PCB and allows for efficient component placement.

No. of Terminals: 16

Sufficient number of terminals for versatile connectivity options.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Advanced package style that enables high-density mounting and interconnectivity.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage for energy-efficient operation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range for reliable performance in various environments.

Minimum Operating Temperature: -30 °C

Ability to operate in cold temperatures without compromising functionality.

Terminal Position: BOTTOM

Facilitates easy soldering and mounting on the PCB.

Maximum Seated Height: 0.675 mm

Low-profile design for space-constrained applications.

Width: 1.96 mm

Compact width that fits well within tight PCB layouts.

Length: 1.96 mm

Compact length that contributes to the overall small footprint of the IC.

Terminal Form: BALL

Ball terminals provide a reliable and robust connection to the PCB.

Nominal Supply Voltage: 1.8 V

Stable and commonly used supply voltage for consistent performance.

Terminal Pitch: 0.5 mm

Fine pitch terminal layout enables high-density mounting and connectivity.

Interface IC Type: INTERFACE CIRCUIT

Specialized for interfacing between different systems or components, making it versatile for various applications.

Technical Specifications

Other Function Interface ICs LM8335TLE attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B16

Length:

1.96 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.675 mm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

1.96 mm

Trade Compliance

LM8335TLE Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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