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LM8328TME

Texas Instruments

LM8328TME by Texas Instruments

LM8328TME by Texas Instruments is an interface IC with 25 terminals in a square package. It operates b/w -40 to 85°C, with supply voltage ranging from 1.62V to 1.98V. Suitable for industrial applications, it features a very thin profile and fine pitch grid array package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,687 parts In-Stock

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8,687

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Digiode

USA . 616 parts In-Stock

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616

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Distributors (Availability)

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Parana Technologies

USA . 1,361 parts In-Stock

1+ parts

$12.181

100+ parts

-

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$12.592

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1,361

$12.181

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$12.592

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AZTECH Wire

Italy . 865 parts In-Stock

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$12.786

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865

$12.786

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ChromeModa Solutions

Germany . 5,627 parts In-Stock

1+ parts

$13.686

100+ parts

$11.223

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5,627

$13.686

$11.223

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IDEA Electronic Components Group

UK . 403 parts In-Stock

1+ parts

$13.686

100+ parts

$13.002

1k+ parts

$12.317

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403

$13.686

$13.002

$12.317

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One Stop Electronics

USA . 256 parts In-Stock

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$20.500

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256

$20.500

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 1,517 parts In-Stock

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1,517

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DigiPath Technology Company

USA . 1,283 parts In-Stock

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$12.339

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$12.339

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Kepictronics

USA . 572 parts In-Stock

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572

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Overview

Unlock endless possibilities with the LM8328TME by Texas Instruments, a cutting-edge interface IC that sets the standard for quality and reliability. Designed with precision in mind, this product offers unparalleled performance in a variety of applications. Whether you're looking to enhance your IoT devices or streamline your industrial processes, the LM8328TME delivers unmatched value, efficiency, and functionality. Trust in Texas Instruments to provide innovative solutions that push the boundaries of technology and bring your ideas to life. Elevate your projects with the LM8328TME and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the integrated circuits inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.98 V

With a maximum supply voltage of 1.98 V, this product is suitable for a wide range of applications without risk of overloading.

Package Shape: SQUARE

The square package shape helps in efficient placement on circuit boards and reduces wasted space, making it ideal for compact designs.

No. of Terminals: 25

Having 25 terminals allows for a greater connection options, making it versatile for various interfaces and functions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments, ensuring reliability in various conditions.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40°C makes this product suitable for use in cold environments or during temperature fluctuations.

Width: 2.015 mm

The small width of 2.015 mm allows for compact and space-saving designs, making it ideal for applications where size is a concern.

Temperature Grade: INDUSTRIAL

Being industrial grade means this product is designed to withstand harsh industrial environments, ensuring durability and reliability in tough conditions.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication between different components or systems, making it essential for seamless integration and operation.

Technical Specifications

Other Function Interface ICs LM8328TME attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B25

Length:

2.015 mm

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.675 mm

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

2.015 mm

Trade Compliance

LM8328TME Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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