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LM8328TMX/NOPB

Texas Instruments

LM8328TMX/NOPB by Texas Instruments

LM8328TMX/NOPB by Texas Instruments is a 25-terminal interface IC with a supply voltage range of 1.62V to 1.98V, operating from -40°C to 85°C. It features a grid array package style with very thin profile and fine pitch, suitable for industrial applications requiring precise interface circuitry in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,399 parts In-Stock

1+ parts

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4,399

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Vyrian

USA . 4,019 parts In-Stock

1+ parts

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4,019

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Anansix

USA . 1,004 parts In-Stock

1+ parts

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1,004

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 665 parts In-Stock

1+ parts

$3.230

100+ parts

-

1k+ parts

$3.752

10k+ parts

-

665

$3.230

-

$3.752

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ChromeModa Solutions

Germany . 2,953 parts In-Stock

1+ parts

$3.629

100+ parts

$2.976

1k+ parts

-

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2,953

$3.629

$2.976

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IDEA Electronic Components Group

UK . 525 parts In-Stock

1+ parts

$3.629

100+ parts

-

1k+ parts

$3.266

10k+ parts

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525

$3.629

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$3.266

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AZTECH Wire

Italy . 504 parts In-Stock

1+ parts

$8.153

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504

$8.153

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Microchip USA

USA . 1,555 parts In-Stock

1+ parts

$10.160

100+ parts

$10.100

1k+ parts

$10.070

10k+ parts

$10.040

1,555

$10.160

$10.100

$10.070

$10.040

Component Stockers USA

USA . 3,425 parts In-Stock

1+ parts

$20.130

100+ parts

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3,425

$20.130

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One Stop Electronics

USA . 1,392 parts In-Stock

1+ parts

$41.500

100+ parts

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1,392

$41.500

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Corphita

USA . 3,716 parts In-Stock

1+ parts

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3,716

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DigiPath Technology Company

USA . 334 parts In-Stock

1+ parts

-

100+ parts

$3.272

1k+ parts

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10k+ parts

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334

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$3.272

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Overview

Unlock the potential of your electronic devices with the LM8328TMX/NOPB by Texas Instruments. This cutting-edge interface IC offers unparalleled quality and reliability, thanks to its manufacturer's reputation for excellence. Perfect for a wide range of applications, this product delivers exceptional value, benefits, and advantages to customers. Elevate your projects with the LM8328TMX/NOPB and experience the difference that top-tier technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC.

Surface Mount: YES

Allows for easy and efficient installation on PCBs.

Maximum Supply Voltage: 1.98 V

Suitable for various low-power applications.

Package Shape: SQUARE

Helps in efficient PCB footprint space utilization.

No. of Terminals: 25

Offers multiple connection points for interfacing with other components.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables high density mounting and space-saving on the PCB.

Minimum Operating Temperature: -40 °C

Suitable for industrial environments with extreme temperature conditions.

Terminal Finish: TIN SILVER COPPER

Provides a reliable and corrosion-resistant terminal connection.

Width: 2.015 mm

Compact size for space-constrained applications.

Peak Reflow Temperature: 260 °C

Allows for high-temperature soldering during installation.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial operating conditions.

Nominal Supply Voltage: 1.8 V

Standard voltage level for compatibility with other components.

Terminal Pitch: 0.4 mm

Fine pitch for high-density mounting and connectivity.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing with other electronic devices or components.

Technical Specifications

Other Function Interface ICs LM8328TMX/NOPB attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Length:

2.015 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.015 mm

Trade Compliance

LM8328TMX/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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