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LM8328TME/NOPB

Texas Instruments

LM8328TME/NOPB by Texas Instruments

LM8328TME/NOPB by Texas Instruments is a 25-terminal interface IC with a supply voltage range of 1.62V to 1.98V. It features a very thin profile, fine pitch grid array package style suitable for industrial applications. With peak reflow temperature of 260°C, it is ideal for use in various electronic devices requiring precise interface circuitry.

Median Price

$2.704

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 450 parts In-Stock

1+ parts

$2.822

100+ parts

$2.473

1k+ parts

$1.397

10k+ parts

-

450

$2.822

$2.473

$1.397

-

Rochester

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

$2.310

1k+ parts

$2.070

10k+ parts

$1.940

7,500

-

$2.310

$2.070

$1.940

DigiKey

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

$3.040

1k+ parts

-

10k+ parts

-

7,500

-

$3.040

-

-

Verical

USA . 6,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.587

10k+ parts

$2.425

6,250

-

-

$2.587

$2.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 5,125 parts In-Stock

1+ parts

$1.843

100+ parts

-

1k+ parts

-

10k+ parts

-

5,125

$1.843

-

-

-

Vyrian

USA . 1,974 parts In-Stock

1+ parts

$1.940

100+ parts

-

1k+ parts

-

10k+ parts

-

1,974

$1.940

-

-

-

Anansix

USA . 1,338 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,338

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,099 parts In-Stock

1+ parts

$1.746

100+ parts

-

1k+ parts

-

10k+ parts

-

4,099

$1.746

-

-

-

Parana Technologies

USA . 1,941 parts In-Stock

1+ parts

$6.760

100+ parts

-

1k+ parts

$7.424

10k+ parts

-

1,941

$6.760

-

$7.424

-

DigiPath Technology Company

USA . 382 parts In-Stock

1+ parts

$7.443

100+ parts

$6.848

1k+ parts

-

10k+ parts

-

382

$7.443

$6.848

-

-

ChromeModa Solutions

Germany . 6,899 parts In-Stock

1+ parts

$7.595

100+ parts

$6.228

1k+ parts

-

10k+ parts

-

6,899

$7.595

$6.228

-

-

IDEA Electronic Components Group

UK . 101 parts In-Stock

1+ parts

$7.595

100+ parts

-

1k+ parts

$6.836

10k+ parts

-

101

$7.595

-

$6.836

-

Microchip USA

USA . 1,895 parts In-Stock

1+ parts

$16.970

100+ parts

$16.860

1k+ parts

$16.810

10k+ parts

$16.760

1,895

$16.970

$16.860

$16.810

$16.760

QUARKTWIN TECHNOLOGY LTD

USA . 16,938 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,938

-

-

-

-

Overview

Discover the LM8328TME/NOPB by Texas Instruments, a cutting-edge Other Function Interface IC that sets the standard for quality and reliability in the industry. With a focus on innovation and precision engineering, Texas Instruments delivers a product that exceeds expectations in various applications. Offering unrivaled value and benefits to customers, this interface circuit showcases advanced technology, robust performance, and versatile functionality. Experience seamless integration and unparalleled performance with the LM8328TME/NOPB, setting new standards in interface IC technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use

Surface Mount: YES

Allows for easy and efficient installation on circuit boards

Maximum Supply Voltage: 1.98 V

Suitable for a wide range of applications without exceeding safe voltage limits

Package Shape: SQUARE

Compact design for space-saving in electronic devices

No. of Terminals: 25

Offers flexibility and connectivity for various functions

Minimum Supply Voltage: 1.62 V

Ensures stable operation even at lower voltage levels

Maximum Operating Temperature: 85 °C

Can withstand high temperatures without affecting performance

Minimum Operating Temperature: -40 °C

Suitable for use in extreme temperature conditions

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance

Terminal Position: BOTTOM

Facilitates easy soldering and connection to circuit boards

Maximum Seated Height: 0.675 mm

Low profile design for compact devices

Width: 2.015 mm

Narrow width for space-efficient layout on PCBs

Maximum Time At Peak Reflow Temperature (s): 30

Optimizes reflow soldering process for efficient assembly

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during manufacturing

Length: 2.015 mm

Compact length for efficient PCB design

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with varying temperature requirements

Terminal Form: BALL

Allows for easy connection and soldering

Nominal Supply Voltage: 1.8 V

Optimal voltage level for stable and efficient operation

Terminal Pitch: 0.4 mm

Fine pitch for high-density PCB designs

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuit applications

Technical Specifications

Other Function Interface ICs LM8328TME/NOPB attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Length:

2.015 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.015 mm

Trade Compliance

LM8328TME/NOPB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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