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PCA9600DP/S911,118

NXP Semiconductors

PCA9600DP/S911,118 by NXP Semiconductors

NXP Semiconductors' PCA9600DP/S911,118 is an Interface IC with 2 functions, operating at a voltage range of 2.5V to 15V. It comes in a small outline package suitable for industrial applications requiring temperature tolerance from -40°C to 85°C. Ideal for surface mount designs needing a compact solution with gull wing terminals and shrink pitch style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,207 parts In-Stock

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Anansix

USA . 2,808 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Digiode

USA . 808 parts In-Stock

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808

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AZTECH Wire

Italy . 313 parts In-Stock

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$7.697

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313

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Aztec Data Supply Inc.

USA . 92 parts In-Stock

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$8.210

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$8.809

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$8.368

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$8.368

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$8.368

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Corohmni

South Africa . 11 parts In-Stock

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$9.775

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Semicontronic

India . 1,571 parts In-Stock

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$28.500

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$27.788

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$27.645

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One Stop Electronics

USA . 1,136 parts In-Stock

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$33.500

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UNI Independent Distributors

Spain . 4,637 parts In-Stock

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Continental Prestige Electronics

USA . 3,791 parts In-Stock

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Corphita

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Argo Parts USA

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Modulus Dynamics

Lithuania . 550 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Microchip USA

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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$0.046

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$0.046

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$0.046

Overview

Enhance your electronic designs with the PCA9600DP/S911,118 by NXP Semiconductors. This innovative interface circuit offers unmatched quality and reliability, thanks to the leading manufacturer behind it. Perfect for a wide range of applications, this product provides seamless connectivity and efficient performance. Experience the value and benefits of this cutting-edge solution today, and see how it can elevate your projects to new heights. Upgrade your designs with the PCA9600DP/S911,118 and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the IC, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto a circuit board, saving time and effort during production.

Maximum Supply Voltage: 15 V

With a high maximum supply voltage of 15V, this IC can handle a wide range of input voltages, making it versatile for various power requirements.

No. of Functions: 2

Having multiple functions in a single IC reduces the need for additional components, saving space and cost in the overall system design.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space, making it ideal for applications where board real estate is limited.

No. of Terminals: 8

8 terminals provide flexibility for connecting to other components in the circuit, enabling complex functionality and communication.

Minimum Supply Voltage: 2.5 V

The low minimum supply voltage of 2.5V allows for operation in low power environments, making it suitable for battery-operated devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables operation in extreme cold conditions, expanding the range of possible applications.

Terminal Position: DUAL

The dual terminal position provides redundancy and enhances signal integrity, contributing to the overall reliability of the IC.

Maximum Seated Height: 1.1 mm

A low maximum seated height of 1.1mm allows for compact and thin designs, making it suitable for space-constrained applications.

Width: 3 mm

The narrow width of 3mm enables efficient layout on a PCB, maximizing space utilization and facilitating design optimization.

Length: 3 mm

The compact length of 3mm further contributes to the space-saving design of the IC, making it ideal for miniaturized devices.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC can withstand tough operating conditions and deliver reliable performance in demanding environments.

Terminal Form: GULL WING

Gull wing terminal form provides strong solder connections and easier inspection during manufacturing, ensuring robust assembly and quality control.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in many systems, offering compatibility and interoperability with existing circuits and devices.

Terminal Pitch: 0.65 mm

With a fine terminal pitch of 0.65mm, this IC allows for dense packing on a PCB, optimizing space usage and enabling high-performance designs.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication between different subsystems, enabling seamless data exchange and integration in complex electronics applications.

Technical Specifications

Other Function Interface ICs PCA9600DP/S911,118 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

PCA9600DP/S911,118 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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