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ISO7741FEDWRQ1

Texas Instruments

ISO7741FEDWRQ1 by Texas Instruments

ISO7741FEDWRQ1 by Texas Instruments is a 16-terminal IC with 4 functions, operating at -50 to 150°C. It has a supply voltage range of 2.25-5.5V and is AEC-Q100 compliant for automotive applications. The CMOS technology interface circuit is surface-mountable and features Gull Wing terminals, making it suitable for various automotive electronic systems.

Median Price

$3.680

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,181 parts In-Stock

1+ parts

$2.153

100+ parts

$1.778

1k+ parts

$0.961

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10,181

$2.153

$1.778

$0.961

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DigiKey

USA . 1,887 parts In-Stock

1+ parts

$3.680

100+ parts

$2.296

1k+ parts

$2.156

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1,887

$3.680

$2.296

$2.156

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Mouser Electronics

USA . 1,302 parts In-Stock

1+ parts

$3.680

100+ parts

$2.300

1k+ parts

$2.050

10k+ parts

$1.950

1,302

$3.680

$2.300

$2.050

$1.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,409 parts In-Stock

1+ parts

$2.045

100+ parts

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2,409

$2.045

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Nova Conductors

Japan . 150 parts In-Stock

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$2.069

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150

$2.069

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Chip Stock

USA . 6,865 parts In-Stock

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6,865

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Vyrian

USA . 4,926 parts In-Stock

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4,926

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ACDS - Activité Composants Distribution Service

France . 1,000 parts In-Stock

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1,000

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Dan-Mar Components

USA . 1,000 parts In-Stock

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Bristol Electronics

USA . 103 parts In-Stock

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103

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 4,783 parts In-Stock

1+ parts

$1.830

100+ parts

$1.784

1k+ parts

$1.775

10k+ parts

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4,783

$1.830

$1.784

$1.775

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Ampacity Inc.

Singapore . 4,535 parts In-Stock

1+ parts

$1.830

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4,535

$1.830

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Corphita

USA . 1,240 parts In-Stock

1+ parts

$1.938

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1,240

$1.938

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$2.027

100+ parts

-

1k+ parts

$1.946

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500

$2.027

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$1.946

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Continental Prestige Electronics

USA . 4,742 parts In-Stock

1+ parts

$2.069

100+ parts

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$2.027

4,742

$2.069

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$2.027

Argo Parts USA

USA . 971 parts In-Stock

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$2.069

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971

$2.069

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Parana Technologies

USA . 246 parts In-Stock

1+ parts

$10.527

100+ parts

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$11.035

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246

$10.527

-

$11.035

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DigiPath Technology Company

USA . 1,240 parts In-Stock

1+ parts

$11.591

100+ parts

$10.664

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1,240

$11.591

$10.664

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ChromeModa Solutions

Germany . 4,940 parts In-Stock

1+ parts

$11.828

100+ parts

$9.699

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4,940

$11.828

$9.699

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IDEA Electronic Components Group

UK . 824 parts In-Stock

1+ parts

$11.828

100+ parts

$11.237

1k+ parts

$10.645

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824

$11.828

$11.237

$10.645

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Corohmni

South Africa . 873 parts In-Stock

1+ parts

$12.498

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873

$12.498

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Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$14.073

100+ parts

$13.369

1k+ parts

$13.369

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100

$14.073

$13.369

$13.369

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GreenTree Electronics

Israel . 34,000 parts In-Stock

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Lixinc

USA . 19,457 parts In-Stock

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Authorized Procurement Solutions

USA . 4,100 parts In-Stock

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4,100

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Futuretech Components

Singapore . 1,859 parts In-Stock

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1,859

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Overview

Experience the superior quality and reliability of Texas Instruments with the ISO7741FEDWRQ1, a cutting-edge Other Function Interface IC designed for automotive applications. With advanced features like AEC-Q100 screening and a wide operating temperature range, this product offers unmatched performance and durability. Trust in Texas Instruments to provide innovative solutions that meet the highest industry standards, ensuring your designs stay ahead of the competition. Upgrade your automotive electronics with the ISO7741FEDWRQ1 and experience the value of top-notch technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy installation and integration into circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage levels to accommodate a range of power requirements in diverse applications.

No. of Functions: 4

Offers multiple functions in a single IC, reducing component count and complexity in the design.

Screening Level: AEC-Q100

Compliance with automotive standards ensures high reliability and performance in automotive applications.

Package Shape: RECTANGULAR

Efficient use of space on a PCB and easy to handle during assembly.

No. of Terminals: 16

Provides multiple connectivity options for interfacing with other components in the circuit.

Package Style (Meter): SMALL OUTLINE

Compact form factor saves space on the PCB, important in systems with size constraints.

Minimum Supply Voltage: 2.25 V

Can operate at low voltage levels, enabling usage in energy-efficient applications.

Maximum Operating Temperature: 150 °C

High operating temperature range allows the product to function reliably in harsh environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and improves signal integrity.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly process without damaging the product.

Peak Reflow Temperature °C: 260

High reflow temperature capability for lead-free soldering process, suitable for RoHS compliance.

Temperature Grade: AUTOMOTIVE

Meets stringent automotive industry standards for reliability and performance in automotive applications.

No. of Channels: 4

Multiple channels allow for parallel processing or simultaneous operation of different functions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: GULL WING

Gull wing terminals provide mechanical strength and ease of soldering, enhancing the product's reliability.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for consistent performance and compatibility with standard power sources.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates a moderate level of sensitivity to moisture, suitable for typical storage and handling conditions.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing with other components or systems, making it a versatile choice for diverse applications.

Technical Specifications

Other Function Interface ICs ISO7741FEDWRQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRE VCC2 FROM 2..2-5.5V; ALSO OPERATE WITH 3.3V AND 5 V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-50 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

ISO7741FEDWRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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