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DRV2604YZFT

Texas Instruments

DRV2604YZFT by Texas Instruments

DRV2604YZFT by Texas Instruments is a square-shaped interface IC with 9 terminals. It operates b/w -40 to 85°C, with a supply voltage range of 2.5V to 5.5V. This industrial-grade IC is ideal for applications requiring precise haptic feedback control in compact electronic devices.

Median Price

$1.438

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 500 parts In-Stock

1+ parts

$2.470

100+ parts

$1.503

1k+ parts

-

10k+ parts

-

500

$2.470

$1.503

-

-

Rochester

USA . 414 parts In-Stock

1+ parts

-

100+ parts

$1.390

1k+ parts

$1.150

10k+ parts

$1.030

414

-

$1.390

$1.150

$1.030

Verical

USA . 414 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.438

10k+ parts

$1.288

414

-

-

$1.438

$1.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,414 parts In-Stock

1+ parts

$1.083

100+ parts

-

1k+ parts

-

10k+ parts

-

2,414

$1.083

-

-

-

Nova Conductors

Japan . 85 parts In-Stock

1+ parts

$1.114

100+ parts

-

1k+ parts

-

10k+ parts

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85

$1.114

-

-

-

Vyrian

USA . 5,407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,407

-

-

-

-

DigiKey Marketplace

USA . 414 parts In-Stock

1+ parts

-

100+ parts

$1.190

1k+ parts

-

10k+ parts

-

414

-

$1.190

-

-

Prism Electronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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250

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 411 parts In-Stock

1+ parts

$0.970

100+ parts

$0.946

1k+ parts

$0.941

10k+ parts

-

411

$0.970

$0.946

$0.941

-

Ampacity Inc.

Singapore . 247 parts In-Stock

1+ parts

$0.970

100+ parts

-

1k+ parts

-

10k+ parts

-

247

$0.970

-

-

-

Corphita

USA . 437 parts In-Stock

1+ parts

$1.026

100+ parts

-

1k+ parts

-

10k+ parts

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437

$1.026

-

-

-

Continental Prestige Electronics

USA . 753 parts In-Stock

1+ parts

$1.114

100+ parts

-

1k+ parts

-

10k+ parts

$1.092

753

$1.114

-

-

$1.092

Argo Parts USA

USA . 369 parts In-Stock

1+ parts

$1.114

100+ parts

-

1k+ parts

-

10k+ parts

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369

$1.114

-

-

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Netroflash

USA . 50 parts In-Stock

1+ parts

$1.114

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$1.114

-

-

-

Parana Technologies

USA . 749 parts In-Stock

1+ parts

$2.132

100+ parts

$197.947

1k+ parts

$1.918

10k+ parts

-

749

$2.132

$197.947

$1.918

-

DigiPath Technology Company

USA . 1,582 parts In-Stock

1+ parts

$2.347

100+ parts

-

1k+ parts

-

10k+ parts

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1,582

$2.347

-

-

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ChromeModa Solutions

Germany . 4,778 parts In-Stock

1+ parts

$2.395

100+ parts

$1.964

1k+ parts

-

10k+ parts

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4,778

$2.395

$1.964

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-

IDEA Electronic Components Group

UK . 2,302 parts In-Stock

1+ parts

$2.395

100+ parts

-

1k+ parts

$2.156

10k+ parts

-

2,302

$2.395

-

$2.156

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Microchip USA

USA . 1,433 parts In-Stock

1+ parts

$9.547

100+ parts

-

1k+ parts

-

10k+ parts

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1,433

$9.547

-

-

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A-Z Elektronik GmbH

Germany . 6,231 parts In-Stock

1+ parts

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100+ parts

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6,231

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Alle Elektronik GmbH

Germany . 4,154 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,154

-

-

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iodParts Technologies Inc.

India . 250 parts In-Stock

1+ parts

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100+ parts

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250

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Authorized Procurement Solutions

USA . 4 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4

-

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Overview

Enhance the sensory experience with the DRV2604YZFT by Texas Instruments, a cutting-edge interface IC that delivers unparalleled quality and reliability. Designed for a variety of applications, this surface-mount device offers a wide operating voltage range and industrial-grade temperature support. With a sleek square package style and fine pitch grid array, this product ensures seamless integration into any project. Elevate your designs with Texas Instruments' DRV2604YZFT, providing customers with enhanced value, superior performance, and endless possibilities in creating innovative solutions.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, saving space and making the product suitable for compact designs.

Maximum Supply Voltage: 5.5 V

Can operate at a relatively high voltage, providing flexibility in voltage requirements for different applications.

Package Shape: SQUARE

Square shape allows for easier handling and placement on the PCB.

No. of Terminals: 9

Sufficient number of terminals for connecting to other components and interfacing with external circuitry.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with fine pitch and thin profile enhances the product's overall compactness and suitability for miniature applications.

Minimum Supply Voltage: 2.5 V

Can operate efficiently at lower voltages, conserving energy and enabling use in low-power applications.

Maximum Operating Temperature: 85 °C

Capable of operating in relatively high-temperature environments, increasing the product's durability and versatility.

Minimum Operating Temperature: -40 °C

Can withstand very low temperatures, making it suitable for use in a wide range of operating conditions.

Terminal Finish: TIN SILVER COPPER

Durable and corrosion-resistant terminal finish ensures reliable connections and longevity of the product.

Terminal Position: BOTTOM

Bottom terminal position facilitates the soldering process and helps in achieving a more compact and streamlined PCB layout.

Maximum Seated Height: 0.625 mm

Very low seated height allows for a slim profile and efficient use of vertical space on the PCB.

Width: 1.44 mm

Narrow width contributes to the product's compact size and facilitates dense PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time requirement simplifies the manufacturing process and reduces the risk of heat-related damage to the product.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the reflow soldering process, ensuring proper solder joints and reliable connections.

Length: 1.44 mm

Compact length contributes to the overall small footprint of the product and enables space-efficient PCB designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh environmental conditions and high-temperature operations.

Terminal Form: BALL

Ball terminal form provides a reliable and secure connection, suitable for applications that experience mechanical stress or vibration.

Nominal Supply Voltage: 3.6 V

Stable nominal supply voltage for consistent performance and compatibility with common power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density packaging and precise positioning on the PCB, making the product suitable for advanced electronics applications.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interfacing with other components or systems, enhancing connectivity and communication capabilities of the product.

Technical Specifications

Other Function Interface ICs DRV2604YZFT attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-XBGA-B9

JESD-609 Code:

e1

Length:

1.44 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

9

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.44 mm

Trade Compliance

DRV2604YZFT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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