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DRV2604LDGST

Texas Instruments

DRV2604LDGST by Texas Instruments

DRV2604LDGST by Texas Instruments is a small outline, thin profile IC with 10 terminals and a supply voltage range of 2V to 5.2V. It operates in industrial temperatures from -40°C to 85°C, making it suitable for interface circuits in various applications requiring precise haptic feedback control.

Median Price

$2.870

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 71,780 parts In-Stock

1+ parts

$2.719

100+ parts

$2.092

1k+ parts

$1.101

10k+ parts

-

71,780

$2.719

$2.092

$1.101

-

Mouser Electronics

USA . 892 parts In-Stock

1+ parts

$2.870

100+ parts

$1.770

1k+ parts

$1.530

10k+ parts

$1.470

892

$2.870

$1.770

$1.530

$1.470

DigiKey

USA . 268 parts In-Stock

1+ parts

$2.870

100+ parts

$1.762

1k+ parts

$1.581

10k+ parts

$1.474

268

$2.870

$1.762

$1.581

$1.474

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,877 parts In-Stock

1+ parts

$2.583

100+ parts

-

1k+ parts

-

10k+ parts

-

3,877

$2.583

-

-

-

Vyrian

USA . 2,367 parts In-Stock

1+ parts

$2.719

100+ parts

-

1k+ parts

-

10k+ parts

-

2,367

$2.719

-

-

-

Chip Stock

USA . 88,214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

88,214

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 416 parts In-Stock

1+ parts

$0.873

100+ parts

-

1k+ parts

-

10k+ parts

-

416

$0.873

-

-

-

Northwest PG Solutions

USA . 788 parts In-Stock

1+ parts

$0.960

100+ parts

-

1k+ parts

-

10k+ parts

-

788

$0.960

-

-

-

Corphita

USA . 2,508 parts In-Stock

1+ parts

$2.447

100+ parts

-

1k+ parts

-

10k+ parts

-

2,508

$2.447

-

-

-

Parana Technologies

USA . 2,070 parts In-Stock

1+ parts

$4.538

100+ parts

-

1k+ parts

$4.985

10k+ parts

-

2,070

$4.538

-

$4.985

-

DigiPath Technology Company

USA . 1,140 parts In-Stock

1+ parts

$4.997

100+ parts

-

1k+ parts

-

10k+ parts

-

1,140

$4.997

-

-

-

ChromeModa Solutions

Germany . 1,568 parts In-Stock

1+ parts

$5.099

100+ parts

$4.181

1k+ parts

-

10k+ parts

-

1,568

$5.099

$4.181

-

-

IDEA Electronic Components Group

UK . 317 parts In-Stock

1+ parts

$5.099

100+ parts

-

1k+ parts

$4.589

10k+ parts

-

317

$5.099

-

$4.589

-

XScomponents

USA . 973 parts In-Stock

1+ parts

-

100+ parts

$4.410

1k+ parts

-

10k+ parts

-

973

-

$4.410

-

-

Overview

Enhance your product designs with the DRV2604LDGST from Texas Instruments, a leading manufacturer known for quality and innovation. This versatile interface IC offers a wide range of applications in various industries, providing value and benefits to customers looking for reliable performance. With a robust package design and advanced features, this product delivers superior functionality and efficiency. Experience the advantages of Texas Instruments' expertise and take your projects to the next level with the DRV2604LDGST.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easy installation and reduces the overall size of the product, making it suitable for compact designs.

Maximum Supply Voltage: 5.2 V

The high maximum supply voltage capability provides flexibility in power supply options for the product.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board, optimizing the layout.

No. of Terminals: 10

Having 10 terminals provides sufficient connectivity options for interfacing with other components or peripherals.

Minimum Supply Voltage: 2 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and extended usage.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes the product suitable for use in cold environments or industrial settings.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

The use of multiple finishes on the terminals ensures good conductivity and corrosion resistance, enhancing the product's reliability.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves the overall reliability of the product's connections.

Maximum Seated Height: 1.1 mm

The low seated height of the package allows for a compact design and efficient use of space in the overall system.

Width: 3 mm

The narrow width of the package helps in fitting the product in tight spaces and compact designs.

Maximum Time At Peak Reflow Temperature (s): 30

With a short time at peak reflow temperature, the product is less susceptible to heat-induced damage during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product can withstand the soldering process without compromising its performance.

Length: 3 mm

The compact length of the package contributes to a small overall footprint on the circuit board.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades means the product can operate reliably in demanding industrial environments.

Terminal Form: GULL WING

The gull wing terminal form offers improved mechanical strength and easier automated assembly during manufacturing.

Nominal Supply Voltage: 3.6 V

The nominal supply voltage specification provides a standard operating voltage for the product, ensuring compatibility with common power sources.

Terminal Pitch: 0.5 mm

Having a small terminal pitch allows for high-density mounting and connectivity, making the product suitable for compact designs.

Moisture Sensitivity Level (MSL): 2

A moisture sensitivity level of 2 indicates that the product is moderately sensitive to moisture, suitable for most application environments.

Interface IC Type: INTERFACE CIRCUIT

The interface circuit type allows the product to facilitate communication between different components or systems effectively.

Technical Specifications

Other Function Interface ICs DRV2604LDGST attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

5.2 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

DRV2604LDGST Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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