Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Add filters
All
Selected
MCP2122T-E/SNG
Microchip Technology
MCP2122T-E/SNG by Microchip Technology is an 8-terminal interface IC with a supply voltage range of 1.8V to 5.5V, suitable for TS 16949 screening level applications. This small outline package has a dual terminal position and operates b/w -40°C to 125°C, making it ideal for various CMOS technology-based interface circuit designs.
INTERFACE CIRCUIT
R-PDSO-G8
e3
4.9 mm
1
8
125 Cel
-40 Cel
PLASTIC/EPOXY
SOP
SOP8,.25
RECTANGULAR
SMALL OUTLINE
TS 16949
1.75 mm
5.5 V
1.8 V
5 V
YES
CMOS
MATTE TIN
GULL WING
1.27 mm
DUAL
3.9 mm
MAX3373EEKA
Maxim Integrated
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: RECTANGULAR;
e0
85 Cel
TSSOP
TSSOP8,.1
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
1.8/5
Not Qualified
Other Interface ICs
BICMOS
INDUSTRIAL
TIN LEAD
.635 mm
STCC08
STMicroelectronics
INTERFACE CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
e4
-20 Cel
260
3.3/5
OTHER
NICKEL PALLADIUM GOLD
40
STCC08RL
STCC08RL by STMicroelectronics is an 8-terminal interface IC with power supplies of 3.3/5V, operating temperature range of -20 to 85 °C, and terminal finish in nickel palladium gold. It is a small outline package suitable for surface mount applications in various electronic devices requiring interface circuitry.
TDA9950TT/C3,512
NXP Semiconductors
TDA9950TT/C3,512 by NXP Semiconductors is a versatile interface IC designed for commercial applications. It operates at a nominal voltage of 3.3V, features a compact 20-terminal gull-wing package, and withstands temperatures from 0 °C to 70 °C. Ideal for surface mount technology in various electronic devices.
R-PDSO-G20
20
70 Cel
0 Cel
TSSOP20,.25
3.3
3.3 V
COMMERCIAL
TDA9950TT/C3,518
TDA9950TT/C3,518 by NXP Semiconductors is a compact interface IC designed for efficient signal processing. It operates at 3.3V with a max temp of 70 °C and features a 20-terminal gull-wing package. Ideal for commercial applications requiring reliable performance in tight spaces.
NXB0102GF,115
NXB0102GF,115 by NXP Semiconductors is a compact automotive interface IC with an operating temp range of -40 °C to 125 °C. It features a dual terminal design in a small outline package and supports power supplies from 1.2V to 5V. Ideal for surface mount applications, it ensures reliable performance in demanding environments.
R-PDSO-N8
PLASTIC
SON
SOLCC8,.04,14
1.2/3.6,1.8/5
AUTOMOTIVE
NO LEAD
.35 mm
NXS0102GF,115
NXS0102GF,115 by NXP Semiconductors is a dual terminal interface IC designed for automotive applications. It operates within a temperature range of -40 °C to 125 °C and supports power supplies of 1.8/3.3V, 2.5/5V in a compact SO package. Its no-lead design ensures efficient surface mounting for space-constrained environments.
1.8/3.3,2.5/5
NXS0102GT,115
NXS0102GT,115 by NXP Semiconductors is a dual-terminal interface IC designed for automotive applications. It operates within a temperature range of -40 °C to 125 °C and supports power supplies of 1.8/3.3V, 2.5/5V in a compact SO package. Its surface mount design ensures efficient integration into various electronic systems.
SOLCC8,.04,20
.5 mm
NVT2002GF,115
NVT2002GF,115 by NXP Semiconductors is a compact interface IC designed for industrial applications. It operates within a supply voltage range of 0 to 5.5 V and withstands temperatures from -40 °C to 85 °C. Its small outline and dual terminal design make it ideal for space-constrained environments.
Also Required Vref(B) Supply 0 to 5.5V
1.35 mm
VSON
SMALL OUTLINE, VERY THIN PROFILE
1/3.6,1.8/5.5
5.4 V
0 V
1 mm
PCA9605D,118
PCA9605D,118 by NXP Semiconductors is an 8-terminal interface IC with a supply voltage of 5.5V and operating temperature range from -40 to 85°C. It features CMOS technology, GULL WING terminals, and is ideal for industrial applications requiring small outline package style and surface mount capability.
5.5
.001 mA
30
PCA9605DP,118
PCA9605DP,118 by NXP Semiconductors is an 8-terminal interface IC with a supply voltage of 5.5V and low supply current of 0.001mA. It operates in industrial temperature range (-40 to 85°C) and is suitable for various applications requiring an interface circuit in a small outline package.
TSSOP8,.19
PCA8536AT/Q900/1,1
The PCA8536AT/Q900/1 by NXP Semiconductors is a CMOS interface IC designed for segment displays, supporting up to 40 characters with 320 segments. It operates b/w -40 °C and 95 °C, making it suitable for industrial applications. This surface-mount device features a compact design with 56 terminals and AEC-Q100 screening.
SEGMENT
R-PDSO-G56
8-BP
40-CHARACTER
320
56
95 Cel
TSSOP56,.3,20
2/5
AEC-Q100
.13 mA
PCA8536BT/Q900/1,1
The PCA8536BT/Q900/1 by NXP Semiconductors is a CMOS interface IC designed for segment displays, supporting up to 40 characters and 320 segments. It operates b/w -40 °C to 95 °C with a supply voltage of 2-5V. Ideal for industrial applications, it features a compact SO thin profile package.
PCF8536AT/1,118
PCF8536AT/1,118 by NXP Semiconductors is a CMOS interface IC designed for segment displays with up to 40 characters and 44 segments. It operates b/w -40 °C to 85 °C and supports dual terminals in a compact SO thin profile package. Ideal for industrial applications, it features low power consumption at just 0.13 mA.
44
PCF8536BT/1,118
PCF8536BT/1,118 by NXP Semiconductors is a 56-terminal IC with 44 segments for segment display applications. It operates at temperatures from -40 to 85°C and draws a max current of 0.13mA at 2/5V. The small outline package with gull wing terminals makes it suitable for industrial-grade interface circuits.
NTS0104UK-Q100Z
The NXP Semiconductors NTS0104UK-Q100Z is an AEC-Q100 compliant interface IC with 12 terminals in a grid array package. Operating temperature range from -40 to 125°C, suitable for automotive applications. Features include power supplies of 1.8/3.3V and 2.5/5V, surface mount compatibility, and a rectangular package shape.
R-PBGA-B12
12
FBGA
BGA12,3X4,16
GRID ARRAY, FINE PITCH
BALL
.4 mm
BOTTOM
GTL2018PW/Q900,118
GTL2018PW/Q900,118 by NXP Semiconductors is a robust interface IC designed for industrial applications. It operates at 3.3V with a temperature range of -40 °C to 85 °C and features a compact 24-terminal gull-wing package. Ideal for automotive and harsh environments, it meets AEC-Q100 standards.
R-PDSO-G24
24
TSSOP24,.25
NTB0104UK-Q100Z
NTB0104UK-Q100Z by NXP Semiconductors is an automotive-grade interface IC with a 12-terminal grid array design. It operates b/w -40 °C to 125 °C and supports power supplies of 1.2/3.6V and 1.8/5V, ideal for automotive applications requiring reliability. Its AEC-Q100 screening ensures high performance in demanding environments.
LC75814V-MPB-E
Onsemi
LC75814V-MPB-E by Onsemi is a CMOS IC with 16 segments, operating at -40 to 85 °C. It has a supply current of 0.46 mA and supports 3/5V power supplies. Ideal for industrial applications requiring segment display mode in a small outline package.
R-PDSO-G30
e6
4
4-BP
16
SSOP
SSOP30,.3
SMALL OUTLINE, SHRINK PITCH
3/5
.46 mA
TIN BISMUTH
LC75814VS-MPB-E
LC75814VS-MPB-E by Onsemi is a CMOS IC with 16 segments, suitable for industrial applications. It operates on 3/5V power supplies and has a max operating temperature of 85 °C. With a small outline package style and gull wing terminal form, it is ideal for segment display mode in various electronic devices.
LV5609V-HAS-TLM-E
LV5609V-HAS-TLM-E by Onsemi is a BICMOS tech IC with 20 terminals, 3.3V supply, and temp range of -20 to 80 °C. Ideal for commercial applications requiring small outline package style and surface mount compatibility.
3
80 Cel
SSOP20,.25
COMMERCIAL EXTENDED
LV5609V-MPB-E
LV5609V-MPB-E by Onsemi is a BICMOS technology IC with 20 terminals, operating at -20 to 80°C. It has a supply voltage of 3.3V and peak reflow temp of 260°C. Ideal for applications requiring small outline, shrink pitch packages in commercial extended temperature environments.
LV5609V-TLM-E
LV5609V-TLM-E by Onsemi is a BICMOS technology IC with 20 terminals, operating at -20 to 80 °C. It has a supply voltage of 3.3V and peak reflow temp of 260°C. Ideal for applications requiring small outline surface mount packages.
NTB0102GD-Q100H
NTB0102GD-Q100H by NXP Semiconductors is an automotive interface IC designed for robust performance. It operates within a temperature range of -40 °C to 125 °C and supports power supplies from 1.2V to 5V. This compact, surface-mount device features an AEC-Q100 screening level for reliability in automotive applications.
SOLCC8,.12,20
NTS0102GD-Q100H
The NXP Semiconductors NTS0102GD-Q100H is an AEC-Q100 compliant interface IC with 8 terminals and operates b/w -40°C to 125°C. It supports power supplies of 1.8/3.3V, 2.5/5V and has a peak reflow temperature of 260°C. Ideal for automotive applications due to its small outline package and no-lead terminal form.
SOLCC8,.11,20
PCA9525DP,118
PCA9525DP,118 from NXP Semiconductors is a CMOS interface IC designed for industrial applications. It operates at 3/5V with an extended temp range of -40 °C to 85 °C and features an 8-terminal gull-wing package. Ideal for surface mount designs, it supports efficient communication in compact spaces.
B7A-T6E3
Omron
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Supply Voltage: 12 V; JESD-30 Code: R-XXMA-X;
R-XXMA-X
55 Cel
-10 Cel
UNSPECIFIED
XMA
MICROELECTRONIC ASSEMBLY
24 V
12 V
NO
HYBRID
B7A-T3E3
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Surface Mount: NO;
B7A-T3E8
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XMA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 55 Cel; JESD-30 Code: R-XXMA-X;
B7A-R3A33
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XMA; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED; JESD-30 Code: R-XXMA-X;
B7A-R3A18
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XMA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Terminal Position: UNSPECIFIED;
B7A-R3A38
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -10 Cel; Minimum Supply Voltage: 12 V;
DRT1-COM
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XFM; Package Shape: RECTANGULAR; Nominal Supply Voltage: 24 V; Technology: HYBRID;
R-XXFM-X
XFM
FLANGE MOUNT
26.4 V
20.4 V
GT1-ID16
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XFM; Package Shape: RECTANGULAR; Nominal Supply Voltage: 24 V; Minimum Operating Temperature: -10 Cel;
GT1-OD16
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XFM; Package Shape: RECTANGULAR; Minimum Operating Temperature: -10 Cel; Minimum Supply Voltage: 20.4 V;
GT1-ID16MX
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XFM; Package Shape: RECTANGULAR; JESD-30 Code: R-XXFM-X; Technology: HYBRID;
GT1-OD16MX
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XFM; Package Shape: RECTANGULAR; Surface Mount: NO; Minimum Supply Voltage: 20.4 V;
GT1-ID32ML
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XFM; Package Shape: RECTANGULAR; JESD-30 Code: R-XXFM-X; Minimum Operating Temperature: -10 Cel;
GT1-OD32ML
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XFM; Package Shape: RECTANGULAR; Maximum Operating Temperature: 55 Cel; Minimum Operating Temperature: -10 Cel;
GT1-ROP08
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XFM; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; JESD-30 Code: R-XXFM-X;
GCN1-100
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XFM; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED; Nominal Supply Voltage: 24 V;
GT1-ID16-1
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XFM; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED; Package Body Material: UNSPECIFIED;
GT1-OD16-1
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XFM; Package Shape: RECTANGULAR; No. of Functions: 1; Package Body Material: UNSPECIFIED;
GT1-ID16MX-1
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XFM; Package Shape: RECTANGULAR; Maximum Operating Temperature: 55 Cel; Package Style (Meter): FLANGE MOUNT;
GT1-OD16MX-1
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XFM; Package Shape: RECTANGULAR; Maximum Supply Voltage: 26.4 V; Surface Mount: NO;
GT1-ID32ML-1
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XFM; Package Shape: RECTANGULAR; Maximum Operating Temperature: 55 Cel; Technology: HYBRID;
GT1-OD32ML-1
INTERFACE CIRCUIT; Terminal Form: UNSPECIFIED; Package Code: XFM; Package Shape: RECTANGULAR; Maximum Supply Voltage: 26.4 V; Minimum Operating Temperature: -10 Cel;
© 2023 All rights reserved
