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GTL2018PW/Q900,118

NXP Semiconductors

GTL2018PW/Q900,118 by NXP Semiconductors

GTL2018PW/Q900,118 by NXP Semiconductors is a robust interface IC designed for industrial applications. It operates at 3.3V with a temperature range of -40 °C to 85 °C and features a compact 24-terminal gull-wing package. Ideal for automotive and harsh environments, it meets AEC-Q100 standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,791 parts In-Stock

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7,791

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Digiode

USA . 4,809 parts In-Stock

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4,809

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Anansix

USA . 1,053 parts In-Stock

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1,053

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Distributors (Availability)

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Native Components

USA . 781 parts In-Stock

1+ parts

$0.377

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$0.362

781

$0.377

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$0.362

Northwest PG Solutions

USA . 723 parts In-Stock

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$0.415

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$0.366

723

$0.415

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$0.366

Microchip USA

USA . 222 parts In-Stock

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$8.010

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222

$8.010

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$8.129

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$7.397

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$6.666

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3,000

$8.129

$7.397

$6.666

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AZTECH Wire

Italy . 174 parts In-Stock

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$20.050

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One Stop Electronics

USA . 1,551 parts In-Stock

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$33.500

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1,551

$33.500

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Component Stockers USA

USA . 205 parts In-Stock

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$99.990

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205

$99.990

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UNI Independent Distributors

Spain . 7,927 parts In-Stock

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Corphita

USA . 4,929 parts In-Stock

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Overview

Elevate your designs with the GTL2018PW/Q900,118 from NXP Semiconductors. This exceptional interface IC boasts reliability and performance, making it ideal for automotive and industrial applications. Crafted with precision and built to endure harsh conditions, it ensures seamless functionality in any environment. Trust in NXP's legacy of innovation to deliver enhanced efficiency and robust solutions that empower your projects and drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides a reliable protective barrier against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact design, ensuring efficient use of PCB space and facilitating automated assembly.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures the product meets high standards for automotive applications, promising reliability and longevity.

Package Shape: RECTANGULAR

The rectangular shape offers efficient space utilization and facilitates easy integration into various circuit layouts.

Power Supplies (V): 3.3

Operating with a standard 3.3V power supply makes it compatible with a wide range of electronic devices and reduces power consumption.

No. of Terminals: 24

With 24 terminals, the device can support complex functions and connections, making it suitable for advanced applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The slim package style is ideal for space-constrained designs, providing flexibility for small electronic devices.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures the device can function in challenging environments, enhancing its application range.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes it suitable for use in extreme cold climates, ensuring performance reliability in various conditions.

Terminal Position: DUAL

Dual terminal positions allow for versatile connectivity options, enhancing the product's adaptability in different layouts.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates robustness during soldering processes, reducing the risk of damage during assembly.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product offers enhanced durability and stability, ideal for demanding environments.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering and mechanical stability, ensuring secure connections on the PCB.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V further ensures compatibility with a vast array of modern electronic systems.

Terminal Pitch: 0.635 mm

A small terminal pitch of 0.635 mm allows for denser packaging of components, making it suitable for miniaturized devices.

Technical Specifications

Other Function Interface ICs GTL2018PW/Q900,118 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G24

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Other Interface ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

GTL2018PW/Q900,118 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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