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GTL2002D,112

Rochester Electronics

GTL2002D,112 by Rochester Electronics

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

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Aztec Data Supply Inc.

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Microchip USA

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Advanced Electronics

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AZTECH Wire

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Technical Specifications

Other Function Interface ICs GTL2002D,112 attributes and parameters. Explore more Other Function Interface ICs devices from Rochester Electronics

Specs

Additional Features:

IT HAS 0 TO 5.5 V I/O VOLTAGE

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

GTL2002D,112 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Rochester Electronics

For over 40 years Rochester's growing supplier authorizations enable us to provide the world's largest source of semiconductors. In partnership with over 70 leading component manufacturers, we provide our valued customers with a continuous source of critical semiconductors. Today the Rochester Semiconductor Lifecycle Solution™ offers the world’s largest range of semiconductors with over 15 billion finished devices in stock, combined with extensive manufacturing capabilities from the world's largest die bank at over 12 Billion. Rochester’s growing product and service portfolio continues to provide an authorized source of supply to customers around the world directly, in partnership with our authorized distribution network and through leading-edge e-commerce platforms.

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