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GTL2002DP,118

NXP Semiconductors

GTL2002DP,118 by NXP Semiconductors

GTL2002DP,118 by NXP Semiconductors is an 8-terminal interface IC with a max supply voltage of 5.5V and min operating temp of -40°C. Its small outline package makes it ideal for industrial applications requiring dual terminal position and peak reflow at 260°C.

Median Price

$1.894

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

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$0.789

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550

$0.789

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Bristol Electronics

USA . 177 parts In-Stock

1+ parts

$3.000

100+ parts

$1.860

1k+ parts

$1.500

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177

$3.000

$1.860

$1.500

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Chip Stock

USA . 58,000 parts In-Stock

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58,000

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Vyrian

USA . 7,226 parts In-Stock

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Flip Electronics

USA . 2,480 parts In-Stock

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Atlantic Semiconductor

USA . 1,595 parts In-Stock

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Martec Srl

Italy . 1,445 parts In-Stock

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Anansix

USA . 1,163 parts In-Stock

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Digiode

USA . 1,034 parts In-Stock

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1,034

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Microfarads

USA . 516 parts In-Stock

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516

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SPM Sales

USA . 366 parts In-Stock

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366

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ComSIT Distribution GmbH

Germany . 150 parts In-Stock

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Connect4Technologies Inc.

Canada . 75 parts In-Stock

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Prism Electronics

USA . 41 parts In-Stock

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One Stop Electronics

USA . 1,309 parts In-Stock

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$0.500

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Argo Parts USA

USA . 1,042 parts In-Stock

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$0.789

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1,042

$0.789

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Continental Prestige Electronics

USA . 975 parts In-Stock

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$0.789

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$0.773

975

$0.789

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$0.773

Aztec Data Supply Inc.

USA . 3,535 parts In-Stock

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$2.630

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3,535

$2.630

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AZTECH Wire

Italy . 308 parts In-Stock

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$5.346

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308

$5.346

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$13.720

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$13.034

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$13.034

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100

$13.720

$13.034

$13.034

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Semicontronic

India . 1,536 parts In-Stock

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$42.500

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$41.438

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$41.225

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1,536

$42.500

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Ampacity Inc.

Singapore . 964 parts In-Stock

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$49.500

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$49.500

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Microchip USA

USA . 207 parts In-Stock

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$144.841

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Perfect Parts

USA . 111,251 parts In-Stock

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Infinite Electronics LLP (Excess)

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Corohmni

South Africa . 2,211 parts In-Stock

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GreenTree Electronics

Israel . 2,131 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$0.773

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$0.750

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$0.734

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$0.734

Corphita

USA . 1,616 parts In-Stock

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UNI Independent Distributors

Spain . 1,389 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Authorized Procurement Solutions

USA . 481 parts In-Stock

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iodParts Technologies Inc.

India . 240 parts In-Stock

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$13.204

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Lixinc

USA . 80 parts In-Stock

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Overview

Unleash the power of seamless connectivity with the GTL2002DP,118 by NXP Semiconductors. This cutting-edge interface IC boasts unparalleled quality and reliability, making it the perfect solution for a wide range of applications. From industrial automation to consumer electronics, this small outline, thin profile package offers maximum value and performance. Say goodbye to connectivity issues and hello to streamlined operations with the GTL2002DP,118. Upgrade your systems today and experience the difference that NXP Semiconductors can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the interface IC, ensuring long-term functionality.

Surface Mount: YES

Allows for easy and convenient installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Supports a wide range of voltage inputs, making it versatile and compatible with various systems.

Package Shape: SQUARE

Square shape helps optimize space utilization on circuit boards, especially in compact designs.

Minimum Operating Temperature: -40 °C

Capable of withstanding extremely low temperatures, ensuring reliability in harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring stable electrical connections over time.

Width: 3 mm

Compact size allows for integration into small devices or tight spaces, enhancing design flexibility.

Temperature Grade: INDUSTRIAL

Designed to meet industrial-level temperature requirements, ensuring reliability in demanding applications.

Technical Specifications

Other Function Interface ICs GTL2002DP,118 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

0 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

GTL2002DP,118 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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