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GTL2002DP/Q900,118

NXP Semiconductors

GTL2002DP/Q900,118 by NXP Semiconductors

The NXP Semiconductors GTL2002DP/Q900,118 is an 8-terminal interface IC with a max supply voltage of 5.5V and operating temperature range from -40 to 85°C. It features a small outline package style suitable for industrial applications requiring high reliability and AEC-Q100 screening level compliance.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Digiode

USA . 676 parts In-Stock

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Vyrian

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Anansix

USA . 165 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

Italy . 268 parts In-Stock

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$6.333

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Aztec Data Supply Inc.

USA . 1,398 parts In-Stock

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Corohmni

South Africa . 467 parts In-Stock

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Ampacity Inc.

Singapore . 1,490 parts In-Stock

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One Stop Electronics

USA . 721 parts In-Stock

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$39.500

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Corphita

USA . 4,221 parts In-Stock

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UNI Independent Distributors

Spain . 3,949 parts In-Stock

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Continental Prestige Electronics

USA . 3,706 parts In-Stock

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Argo Parts USA

USA . 2,041 parts In-Stock

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Bastille Electronics

Australia . 53 parts In-Stock

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Overview

Enhance your electronic devices with the GTL2002DP/Q900,118 from NXP Semiconductors. Designed with precision and reliability in mind, this interface IC is perfect for a wide range of applications. With its compact size and advanced features, this product offers exceptional value and performance. Experience seamless connectivity and enhanced functionality with the GTL2002DP/Q900,118. Upgrade your technology today with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and offer good protection for the internal components of the IC, ensuring a longer lifespan and reliability.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V provides flexibility in power supply options and compatibility with various systems.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high quality and reliability, making this IC suitable for automotive applications where durability is crucial.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand harsh environmental conditions, enhancing its versatility and durability.

Technical Specifications

Other Function Interface ICs GTL2002DP/Q900,118 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Additional Features:

Also required VDREF 0 to 5.5V

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

0 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

0 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

GTL2002DP/Q900,118 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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