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GTL2002GM

NXP Semiconductors

GTL2002GM by NXP Semiconductors

The NXP Semiconductors GTL2002GM is an interface IC with a max supply voltage of 5.5V, operating temperature range of -40 to 85°C, and terminal finish of Ni/Pd/Au. It is used in industrial applications requiring a quad-terminal form factor and very thin profile package style for surface mount assembly.

Median Price

$0.323

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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ACDS - Activité Composants Distribution Service

France . 4,000 parts In-Stock

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Bristol Electronics

USA . 4,000 parts In-Stock

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$0.323

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$0.241

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$0.224

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$0.323

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$0.224

Dan-Mar Components

USA . 4,000 parts In-Stock

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Anansix

USA . 1,546 parts In-Stock

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Vyrian

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Digiode

USA . 944 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,481 parts In-Stock

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$6.500

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Corohmni

South Africa . 249 parts In-Stock

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$10.541

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Ampacity Inc.

Singapore . 1,222 parts In-Stock

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$22.500

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Kepictronics

USA . 14,000 parts In-Stock

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UNI Independent Distributors

Spain . 6,001 parts In-Stock

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Argo Parts USA

USA . 4,674 parts In-Stock

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Continental Prestige Electronics

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 1,527 parts In-Stock

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Corphita

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Aranea Global

USA . 100 parts In-Stock

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Overview

Unleash the power of innovation with the GTL2002GM by NXP Semiconductors, a cutting-edge solution in the category of Other Function Interface ICs. Crafted with precision and expertise, this product offers unparalleled quality and reliability, making it the go-to choice for a wide range of applications. From seamless integration to enhanced performance, the GTL2002GM delivers value and benefits like never before. Elevate your projects with this versatile and efficient interface circuit, designed to meet the demands of the industrial world. Experience excellence with NXP Semiconductors and take your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on PCBs.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power requirements for different systems.

Package Shape: SQUARE

Compact square shape saves space on the PCB.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial use.

Technical Specifications

Other Function Interface ICs GTL2002GM attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Additional Features:

Also required VDREF 0 to 5.5V

Interface IC Type:

JESD-30 Code:

S-PQCC-N8

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

0 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

0 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

GTL2002GM Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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