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GTL2003PW

NXP Semiconductors

GTL2003PW by NXP Semiconductors

GTL2003PW by NXP Semiconductors is a 20-terminal interface IC with a supply voltage range of 2.36V to 3.6V, suitable for industrial applications. It features a small outline package style, dual terminal position, and Gull Wing form factor. With an operating temperature range from -40°C to 85°C, it is ideal for various function interface requirements in electronic systems.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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Chip Stock

USA . 33,500 parts In-Stock

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Digiode

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Vyrian

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Anansix

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Ashlea Components Ltd

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Nova Conductors

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J2 Sourcing AB

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Distributors (Availability)

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Ampacity Inc.

Singapore . 938 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 817 parts In-Stock

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One Stop Electronics

USA . 1,408 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

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Bastille Electronics

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Overview

Unlock the potential of your electronic devices with the GTL2003PW by NXP Semiconductors. This cutting-edge Other Function Interface IC boasts superior quality and reliability, thanks to the renowned manufacturer's commitment to excellence. Ideal for a wide range of applications, this versatile component offers customers unmatched value, benefits, and advantages. Upgrade your technology today with the GTL2003PW and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the IC, ensuring a longer lifespan and reliable performance.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, making this IC versatile and suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB space and easy integration into electronic systems.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the IC to function effectively in harsh environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the IC can operate in cold environments without any performance issues.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a commonly used voltage level in electronic systems, ensuring compatibility with existing components.

Technical Specifications

Other Function Interface ICs GTL2003PW attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

2.64 V

Minimum Supply Voltage-1:

2.36 V

Nominal Supply Voltage-1:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

GTL2003PW Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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