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PCF8536AT/1,118

NXP Semiconductors

PCF8536AT/1,118 by NXP Semiconductors

PCF8536AT/1,118 by NXP Semiconductors is a CMOS interface IC designed for segment displays with up to 40 characters and 44 segments. It operates b/w -40 °C to 85 °C and supports dual terminals in a compact SO thin profile package. Ideal for industrial applications, it features low power consumption at just 0.13 mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,466 parts In-Stock

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Digiode

USA . 2,373 parts In-Stock

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Anansix

USA . 1,509 parts In-Stock

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Microchip USA

USA . 355 parts In-Stock

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$4.109

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355

$4.109

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AZTECH Wire

Italy . 647 parts In-Stock

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$10.960

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647

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One Stop Electronics

USA . 690 parts In-Stock

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$42.500

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Corphita

USA . 3,559 parts In-Stock

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3,559

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UNI Independent Distributors

Spain . 3,296 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,573 parts In-Stock

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Overview

Elevate your designs with the PCF8536AT/1,118 from NXP Semiconductors—a leader in innovation and reliability. This versatile interface IC seamlessly integrates into a variety of applications, from industrial displays to consumer electronics, ensuring crisp visibility and performance in any environment. Built with robust materials for durability, it offers exceptional efficiency and temperature resilience. Trust in NXP’s unmatched quality and empower your projects with unmatched precision and flexibility.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures robust protection against environmental factors, making this IC suitable for various applications.

Display Mode: SEGMENT

Segment display mode allows for clear and easy-to-read output, enhancing usability in applications requiring visual feedback.

Surface Mount: YES

The surface mount feature enables efficient use of board space and simplifies the manufacturing process, making assembly faster and more cost-effective.

Package Shape: RECTANGULAR

Rectangular shape optimizes board layout and component placement, facilitating better design flexibility in various electronic devices.

Power Supplies (V): 2/5

The dual power supply range (2-5V) provides versatility for different application requirements, enhancing compatibility across various designs.

No. of Terminals: 56

With 56 terminals, this IC supports complex interfacing and functionality, making it ideal for sophisticated applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile contribute to space-saving designs, ideal for compact devices while maintaining high performance.

No. of Backplanes: 8-BP

Having 8 backplanes allows for increased data handling capabilities, which is essential in multi-channel applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this IC suitable for industrial applications where elevated temperatures may occur.

Minimum Operating Temperature: -40 °C

A wide operating temperature range ensures reliability in extreme conditions, making this product ideal for outdoor and harsh environments.

Terminal Position: DUAL

Dual terminal positioning enhances connectivity options and simplifies integration into various designs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature indicates robustness and compatibility with industrial soldering processes, ensuring reliable assembly.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this IC guarantees performance and durability in demanding applications, providing peace of mind for critical operations.

Technology: CMOS

Leveraging CMOS technology ensures low power consumption and high-speed operation, making this IC efficient and fast.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and provide enhanced mechanical stability, ensuring long-lasting performance.

Maximum Supply Current: 0.13 mA

The low maximum supply current demonstrates energy efficiency, making it suitable for battery-operated devices.

No. of Digits/Characters: 40-CHARACTER

With the capacity for 40 characters, this IC supports a wide range of data display options, useful in versatile applications.

No. of Segments: 44

The 44 segments provide high customization for display formats, allowing for complex visual outputs in user interfaces.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch offers a compact design, enabling high-density layouts while maintaining reliable connections.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit type, this IC effectively manages communication between different components, ensuring compatibility and efficient data transfer.

Technical Specifications

Other Function Interface ICs PCF8536AT/1,118 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G56

Moisture Sensitivity Level (MSL):

1

No. of Backplanes:

8-BP

No. of Digits/Characters:

40-CHARACTER

No. of Segments:

44

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.13 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

PCF8536AT/1,118 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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